The invention discloses a chemical mechanical grinding device, comprising a grinding mechanism, a carrying mechanism and a rotating mechanism connected with the carrying mechanism. The rotating mechanism comprises a driver, the carrying mechanism at least comprises a rotating bearing, and the rotating bearing is a magnetic suspension bearing. In the chemical mechanical grinding device disclosed by the invention, the magnetic suspension bearing is mainly taken as a grinding pad bearing, and a grinding pad is suspended above the magnetic suspension bearing by virtue of magnetic suspension force, thus no mechanical contact is arranged between the grinding pad and the magnetic suspension bearing. The invention aims at applying the magnetic suspension bearing technology to the semiconductor technology industry, so as to substitute the traditional mechanical bearing, thus defects caused by the fact that the mechanical bearing is used, such as mechanical friction loss, energy loss, oil pollution, noise and the like can be overcome. Besides, the magnetic suspension bearing provided by the invention also has the advantages that service life is longer compared with the mechanical bearing and loss caused by wafer scrapping owning to bearing problem is greatly reduced.