The invention relates to an intelligent
power module and a manufacturing method thereof, the intelligent
power module comprises a substrate provided with a
solder mask layer, a sealing compound and a
chip provided with a
metal column, the sealing compound is arranged on the substrate in a mode of being in contact with the
solder mask layer, and a plurality of cavities formed based on the contour shape of a light-transmitting
assembly are arranged in the sealing compound. A
metal column consistent with the light-transmitting
assembly in outline shape is inserted into the cavity in the mode that
soldering paste at the end of the
metal column makes contact with a connecting pad in the cavity, a photosensitive cavity communicated with a glue injection channel is formed in the light-transmitting
assembly, and the glue injection channel is formed in one end of the light-transmitting body in the mode of being communicated with the outside. And the photosensitive cavity is arranged at the other end of the light-transmitting main body in a manner that the contact area with the outside is not less than 50% of the cross sectional area of the light-transmitting main body. The plurality of
light guide grooves, the glue injection channel and the photosensitive cavity are arranged in the light-transmitting body, so that the photosensitive cavity can be connected with the light-transmitting body and removed at the same time after being cured, the retaining probability of the photosensitive glue is reduced, and the packaging efficiency of the intelligent
power module is improved.