The invention discloses a copper electroplating process on the surface of a TC4 titanium alloy. The sample or workpiece is sequentially subjected to alkali washing, degreasing and degreasing, water washing, pickling corrosion, water washing, activation treatment, water washing, electroplating, cleaning, surface passivation, Wash and tumble dry. The invention solves the technical problem that copper plating on the surface of TC4 titanium alloy is difficult to achieve, without pre-plating treatment, the surface of TC4 titanium alloy is directly electroplated with copper at room temperature, the process is stable and reliable, and can obtain good bonding force, uniformity, compactness and smooth surface Copper plating, and has the advantages of simple process, convenient operation, high efficiency, low cost, and easy realization. The bonding force was detected by methods such as file edge method, scratch method, friction method and polishing method, and the coating and the substrate showed very good bonding force.