The invention discloses a
grinding and
polishing pad for a cured
grinding material based on thermal
initiation curing and a preparation method thereof, applied to the fields of precise and super precise
grinding and
polishing processing. The grinding and
polishing pad is characterized in that a grinding material layer (1) contains the following components in percent by
mass: 1-40 percent of grinding material with the
granularity of 50 nanometers to 40 micrometers, 10-60 percent of
prepolymer of polyacrylic ester, 0.5-7 percent of free radical / anions / oxidation-deoxidation thermal initiating agent, 0-2 percent of grinding material surface modifying and dispersing agent, 0-5 percent of accelerator, 0-20 percent of
performance tuning additive and 5-40 percent of activated thinner of esterified
acrylic acid. The preparation method of the grinding and polishing pad comprises the following steps of: (1) sufficiently and uniformly mixing raw materials; (2) preparing a polishing pad mould and preparing an
abrasive particle layer by mould pouring, heating and curing; and (3) bonding the grinding material layer with an elastic or (and) rigid layer by using a bonding agent according to requirements to obtain the grinding and polishing pad required by the invention. The grinding and polishing pad prepared by adopting a thermal
initiation curing method has stable
processing performance, high
processing efficiency and functions of
hydrophily and self-correction and is suitable for precise and super precise processing.