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35 results about "Ablative laser" patented technology

Treatment of presbyopia and other eye disorders using a scanning laser system

InactiveUS6263879B1Efficient and accurate expansionPreventing of open angle glaucomaLaser surgeryDiagnosticsDiseaseGlaucoma
Presbyopia is treated by a method which uses ablative lasers to ablate the sclera tissue and increase the accommodation of the ciliary body. Tissue bleeding is prevented by an ablative laser having a wavelength of between 0.15 and 3.2 micron. A scanning system is proposed to perform various patterns on the sclera area of the cornea to treat presbyopia and to prevent other eye disorder such as glaucoma. Laser parameters are determined for accurate sclera expansion.
Owner:NEOS OCULAR

Apparatus and method for fat removal

InactiveUS20110046616A1Facilitate ablationFacilitate a rapid healing of the tissueSurgical instruments for heatingSubcutaneous fatty tissueRadiation pulse
Exemplary embodiments of the present disclosure provide methods and apparatus for heating and removing subcutaneous fatty tissue using radiation. For example, an ablative laser or the like can be configured to generate a small hole in skin tissue that passes through the entire layer of dermal tissue. The hole size can be small, e.g., on less than about 1 mm or 0.5 mm in diameter. Continued application of the radiation can heat and / or vaporize subcutaneous fat proximal to the lower portion of the hole. Expansion of the heated or vaporized fatty tissue can facilitate ejection of the fatty tissue from the formed hole. The energy of a radiation pulse used to form a hole and heat the fatty tissue can be, e.g., greater than about 0.5 J, e.g., between about 0.5 J and about 35 J. The skin tissue can be cooled or partially frozen before forming one or more such holes therein, and a stabilizing film or plate may be adhered to the skin surface to help stabilize the ablated holes.
Owner:THE GENERAL HOSPITAL CORP

Two-dimensional laser spiral cleaning method

The invention discloses a two-dimensional laser spiral cleaning method. The method is characterized in that a laser cleaning system involves two orthogonal deflection digital galvanometer motors; after passing through an optical isolation system and a collimating system in sequence, a laser is sequentially emitted on reflecting mirrors on shafts of the two orthogonal deflection digital galvanometer motors; after secondary reflection, a field lens restrain the laser to be focused in a two-dimensional plane to scan and ablate stains on the surface of a target material substrate; the interface protocol of the two digital galvanometer motors is XY2-100; and the two digital galvanometer motors are independently controlled. According to the two-dimensional laser spiral cleaning method, for any point in the cleaning area, compared with performing ablating line-by-line, the laser is returned to the vicinity of the point after passing through the outer ring according to a spiral filling path, the area of the point obtains cooling time, and the laser heat accumulation effect is weakened; and the line-by-line scanning speed is the speed of the single galvanometer motor, the spiral scanning speed is the speed vector sum of the two motors, so that compared with a line-by-line scanning mode, laser spiral cleaning is more uniform in effect and higher in cleaning efficiency.
Owner:镇江长悦光电科技有限公司

Method and device for the spectral analysis of a metal coating layer deposited on the surface of a steel strip

The present invention relates to a method for the spectral analysis of a metal coating layer deposited on the surface of a steel strip (1), characterised by the following steps: said strip is moved along an arc of the outer surface (813) of a rotating roller (8) with a cylindrical wall guiding the strip by contact; a so-called ablation laser beam is guided into an internal cavity of the cylindrical wall in order to be placed in optical incidence under a normal axis (41) on the outer surface of the roller on a targeted contact point (11) of the strip and the roller, said beam passing through the wall via a wall opening (811), which is transparent to the beam; a plasma spectral emission distribution from the laser ablation to the contact point is collected by optical feedback in the direction of the normal axis (41) on the outer surface of the roller and through the opening in order to be guided towards a spectral measurement unit; and the normal axis on the outer surface for the optical incidence and feedback is placed in synchronous rotation with the roller. The invention also relates to a device with a plurality of embodiments for implementing the method of the invention, as well as to the advantageous uses thereof.
Owner:CLECIM SAS

Novel uranium isotope ratio measuring device and method

The invention discloses a novel uranium isotope ratio measuring device which mainly comprises a first detection laser, a second detection laser, a beam combiner, an ablation laser, a beam splitter, a first photoelectric detector, a second photoelectric detector, a data acquisition card and an industrial personal computer. Ablating laser emitted by the ablating laser irradiates a sample in the ablating chamber through the second reflecting mirror to excite plasma, laser emitted by the first detecting laser passes through the first polarizing film, laser emitted by the second detecting laser passes through the first reflecting mirror and the polarizing film in sequence, the two beams of laser are combined by the beam combiner and then pass through the plasma, the beam splitter re-splits to the first photoelectric detector and the second photoelectric detector, and the data acquisition card acquires signals of the first photoelectric detector and the second photoelectric detector and transmits the signals to the industrial personal computer. The invention further discloses a novel uranium isotope ratio measuring method. The invention provides a technology which is portable, rapid, high in sensitivity and capable of measuring the uranium isotope ratio in a non-contact mode.
Owner:HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI

Processing method for cutting silicon wafer by utilizing time-resolved shadow imaging technology to assist laser liquid phase ablation

The invention discloses a processing method for cutting a silicon wafer by utilizing a time-resolved shadow imaging technology to assist laser liquid phase ablation in the technical field of laser,. Shadow images of cavitation bubbles and persistent bubbles are captured through an established time-resolved shadow imaging system, and dynamic models of the cavitation bubbles and the persistent bubbles are established; according to the dynamic model of the cavitation bubbles, the repetition frequency of the ablation laser is optimized, and the adverse effect of cavitation bubble refraction on the surface of the silicon wafer is reduced; the type and concentration of a liquid medium are optimized according to the dynamic model of the persistent bubbles, the residence time of the persistent bubbles is regulated and controlled, the persistent bubbles staying on the surface of the silicon wafer for a long time are prevented from reacting with subsequent laser pulses, and the adverse effect of the rupture impact effect of the persistent bubbles on the surface of the silicon wafer is relieved; and the processing method provided by the invention is utilized to process the silicon wafer, the obtained kerf is narrow, the heat affected zone is small, the sputter deposition range of the micro-nano particles is small, and the negative influence of induced bubbles is small.
Owner:SHANDONG UNIV OF TECH
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