The problem to be solved by the invention is to provide an
epoxy resin composition for a prepreg, which is used in the manufacture of a
printed circuit board containing a multilayer
printed circuit board, wherein the
epoxy resin composition for a prepreg is characterized by containing as essential components, a
phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an
epoxy resin in the molecule, and that has 0.8 or more on average of a
phosphorus element; a
bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an
inorganic filler; and a
molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the
phosphorus compound with the
bifunctional epoxy resin and the multi-functional epoxy resin, or the
bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the
inorganic filler, and the
molybdenum compound, which is excellent in
flame retardance,
heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of
combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer
printed circuit board using the prepreg.