The invention provides a novel piezoelectric
wafer control type non-contact glue dispensing device with the advantages that the structure is simple, the maintenance is convenient, and the cost is low. The micro vibration displacement of a piezoelectric
wafer is amplified through a displacement amplification mechanism, a
firing pin is driven to vertically move, and the glue liquid spraying is realized. The novel piezoelectric
wafer control type non-contact glue dispensing device adopts the following technical scheme that the displacement amplification mechanism consists of the piezoelectric wafer, a diaphragm spring, a
mass block, a vibration rod and the
firing pin, when the
voltage frequency exerted on the piezoelectric wafer approaches to or is identical to the inherent frequency of the displacement amplification mechanism, the displacement amplification mechanism reaches the
resonance state, the output displacement and the speed of the
firing pin reach the maximum values, the glue liquid is driven to be sprayed out from a
spray nozzle, and the automatic distribution of the glue liquid is realized. The novel piezoelectric wafer control type non-contact glue dispensing device can be used for the fields of precise chemicals,
medicine quantitative distribution,
biomedicine and the like, is particularly applied to the technical field of high-
viscosity glue dispensing in
semiconductor encapsulation and is used for the
chip fixation, the
surface mounting and the bottom
filling in the electronic encapsulation, the fluorescent
powder coating in a
liquid crystal display flat plate and the like.