32results about How to "More resilient" patented technology

An implantable medical device includes a porous metal foam or foam-like structure having pores defined by metal struts or webs wherein the porous structure has directionally controlled pore characteristics. The pore characteristics controlled include one or more of the metal structure porosity, pore size, pore shape, pore size distribution and strut thickness. The pore characteristics may vary in one or more directions throughout the structure. Preferably the pore characteristics are controlled to match the porous metal structure to various mechanical and biological requirements of different regions of the structure in order to optimize aspects of the implants performance and may vary not only over the surface of the porous structure but through the depth of the porous structure. The thickness of the porous metal structure may also be modified to establish a thickness profile that optimizes mechanical and biological requirements of the implants performance. Acetabular cup embodiments of the invention are described. Various methods of manufacturing implants having directionally controlled pore characteristics are described.

A balloon catheter having a balloon disposed upon an elongate shaft near a relatively rigid distal insertion tip, a fluid lumen for fluid communication with a body cavity and an inflation lumen for fluid communication with the balloon. The balloon holds the catheter tip within a body cavity such as the stomach for long-term enteral feeding. The balloon is configured such that upon inflation, the balloon distends distally to cover the distal tip thus insulating it from sensitive anatomy.

A drinking container has a bottle with an open top, a cap assembly attachable to the bottle to cover the open top, and a drinking spout with a top opening on the cap assembly. A spout cover is removably fitted on the top opening of the drinking spout. A flexible tether is connected to the spout cover and to the cap assembly or the bottle. The tether is looped unto itself permitting the spout cover and a portion of the tether to be extended to reach the top opening and to be retracted withdrawing the spout cover to a position remote from the drinking spout.

A balloon catheter having a balloon disposed upon an elongate shaft near a relatively rigid distal insertion tip, a fluid lumen for fluid communication with a body cavity and an inflation lumen for fluid communication with the balloon. The balloon holds the catheter tip within a body cavity such as the stomach for long-term enteral feeding. The balloon is configured such that upon inflation, the balloon distends distally to cover the distal tip thus insulating it from sensitive anatomy.

A disposable beverage cup carrier is preferably made from molded pulp, plastic or other resilient material capable of withstanding the force of four filled beverage cups while carried by integral carrying handle and preventing collapsing of the carrier and resultant spillage of the hot or cold beverage. The beverage cup carrier has a top surface, generally square in shape, of sufficient diameter capable of accommodating a integral ergonomically carrying handle. The beverage cup carrier is capable of holding one to four cups of various sizes and shapes of beverage containers providing a safe and sturdy means during transportation preventing spillage. The integral carrying handle positioned in the center of the top surface allows the user to carry up to four beverage containers with one hand providing enhanced safety and allowing a free hand for purposes of opening the door of one's automobile. The larger surface area of the top surface to accommodate the carrying handle further provides more stability to the carrier. The beverage cup carrier is a unitary mold and is capable of nesting with a plurality of similar beverage cup carriers. The top surface is attached to a peripheral rim by a plurality of annular rib components. The peripheral rim having four rounded corners at which points are positioned sockets to receive the beverage cups. The sockets extending downwardly about five inches in depth from a bottom surface containing stabilizing components within an internal wall of the sockets to provide stability by exerting an external force against the beverage container during use.

An improved cassette for use in the formation of an electrophoretic gel comprises two plates with substantially planar walls having two sides and two ends so arranged in a side by side spaced apart array to form a gel receiving space between them. A plurality of dividing ribs on one or each of the walls extend from a first end of the wall or walls substantially parallel to at least one of the sides thereof to a rib base end. The ribs extend into the space so as to subdivide at least one end of the space into a plurality of substantially parallel wells. A plurality of holes extend through at least one of the walls of the cassette located at or adjacent the base of the dividing rib and aligned with the rib. The arrangement of holes allow sufficient current flow to replace that lost due to the dividing ribs. The structure retains the advantage of having solid dividing walls which are considerably more resilient than dividing walls made from fingers of gel even when reinforced with pegs or projections and yet by virtue of the provision of a hole at the base of the ribs allows sufficient current flow at the base of each rib that the current flow through the space is substantially uniform, thus preventing spreading of the bands as they form in the body of the gel.

An adjustable shock attenuating means comprises at least one arch element (1) and at least one tensile element (2) arranged between any two positions at a concave surface of the element (1) or between two ends of the arch element (1). This means further comprises at least one additional arch element (12) arranged intersecting with the arch element (1) or arranged with the arch element (1) side by side. The arch element (1) has a U-shaped cut-out (13, 14) at its two ends respectively and the tensile element (2) correspondingly has a connecting piece (23, 24) at its two ends respectively to be coupled with the U-shaped cut-outs (13, 14) of the arch element (1) with which the tensile element (2) is coupled with the arch element (1).

A copolymer which can be formed from a mixture of nylon 6,12 and nylon 6,10 along with other possible components. The nylon copolymer is not only clear (transparent) but also exhibits high dimensional stability in varying environments, limited water absorption, good wear resistance, the ability to accommodate large amounts of glass fillers, and is more resilient and tougher than either nylon 6,10 or nylon 6, 12. Moreover, the crystallinity rate of this combination of homopolymers is reduced to further improve clarity and transparency.

The present invention describes thick film photolithographic molds, methods of making thick film photolithographic molds, and methods of using thick film photolithographic molds to form spacers on a substrate. The thick film photolithographic molds preferably comprise an epoxy bisphenol A novolac resin. The present invention also describes sol gel spacers comprising sodium silicates and potassium silicates. The thick film photolithographic molds and sol gel spacers of the present invention can be used in flat panel displays, such as field emission displays and plasma displays.

A slat arrangement for redirecting the trajectory of a bullet has a plurality of elongated steel slats, and each elongated steel slat has a longitudinal front edge and a longitudinal back edge stretching between a first end and a second end. The steel slats are positioned in a louver-like fashion for changing the direction of a bullet following a trajectory along the normal of the slat arrangement. A support structure is connected to each steel slat at the back edge of the steel slat, between the first end and the second end of the steel slat.

A modular shell system of a hard insulation material fabricated in a geometric shape that encapsulates a pipe in insulation is provided. In an attic installation for example, the entire insulation component is inserted over a pipe and into the space between the building structural wood framing members resting on the interior sheathing below. By placing a series of these interlocking insulating modules along a pipe that is run perpendicular to the building construction members, the piping is encapsulated in a continuous insulating system along its entire length. This design facilitates natural heat flow into the pipe with an open pipe slot cavity in the insulating module that allows natural convection heat to pass up through the elongated piping slot, allowing it to come into contact with this piping.

A modular shell system of a hard insulation material fabricated in a geometric shape that encapsulates a pipe in insulation is provided. In an attic installation for example, the entire insulation component is inserted over a pipe and into the space between the building structural wood framing members resting on the interior sheathing below. By placing a series of these interlocking insulating modules along a pipe that is run perpendicular to the building construction members, the piping is encapsulated in a continuous insulating system along its entire length. This design facilitates natural heat flow into the pipe with an open pipe slot cavity in the insulating module that allows natural convection heat to pass up through the elongated piping slot, allowing it to come into contact with this piping.

A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.

A method and apparatus for offloading processing tasks from a first computing environment to a second computing environment, such as from a first interpreter emulation environment to a second native operating system within which the interpreter is running. The offloading method uses memory queues in the first computing environment that are accessible by the first computing environment and one or more offload engines residing in the second computing environment. Using the queues, the first computing environment can allocate and queue a control block for access by a corresponding offload engine. Once the offload engine dequeues the control block and performs the processing task in the control block, the control block is returned for interrogation into the success or failure of the requested processing task. The offload engine is a separate process in a separate computing environment, and does not execute as part of any portion of the first computing environment.

A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.

The invention relates to a slat arrangement for redirecting the trajectory of a bullet. The slat arrangement has a plurality of elongated steel slats, and each elongated steel slat has a longitudinal front edge and a longitudinal back edge stretching between a first end and a second end. The slat arrangement also has a support structure for supporting the plurality of steel slats. The steel slats are positioned in a louver-like fashion for changing the direction of a bullet following a trajectory along the normal of the slat arrangement. The support structure is connected to each steel slat at the back edge of the steel slat and between the first end and the second end of the steel slat.