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31results about How to "Minimal absorption" patented technology

Semiconductor encapsulating epoxy resin composition and semiconductor device

An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
Owner:SHIN ETSU CHEM IND CO LTD

Lithium-titanium complex oxide and manufacturing method thereof, and battery electrode using same

A lithium-titanium complex oxide whose total water generation amount and total carbon dioxide generation amount measured by thermal decomposition GC-MS are preferably 1500 wt ppm or less and 2000 wt ppm or less, respectively, is obtained by subjecting a mixture of titanium compound and lithium compound to a heat treatment at 600° C. or above, cooling the obtained reaction product to 50° C. or below, and then subjecting the cooled reaction product to a reheat treatment involving heating to the maximum temperature of 300 to 700° C. and then cooling, wherein the dew point of the ambience of the reheat treatment is controlled at −30° C. or below at a temperature of 200° C. or above.
Owner:TAIYO YUDEN KK

Semiconductor encapsulating epoxy resin composition and semiconductor device

ActiveUS20060241250A1High TgMinimal moisture absorptionSynthetic resin layered productsThin material handlingEpoxyAlkane
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
Owner:SHIN ETSU CHEM IND CO LTD

Methods of treating microbial infections, including mastitis

ActiveUS20150366797A1Minimal absorptionTreatment and prevention of mastitisAntibacterial agentsBiocideMastitisPolymicrobial Infections
The invention includes methods and compositions for treating mastitis in a subject. The method includes the step of administering, by intramammary delivery, a therapeutically effective amount of a polyether ionophore, or a therapeutically acceptable salt thereof, to the mammary gland of the subject.
Owner:LUODA PHARMA LTD

Hybrid chip-on-board LED module with patterned encapsulation

ActiveUS20160329472A1Efficient productionMinimal efficiency-reducing absorptionPlanar light sourcesElectroluminescent light sourcesOn boardSealant
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).
Owner:LUMILEDS

Hole-transporting self-organised monolayer for perovskite solar cells

The present invention addresses uniformly formed layers on TCOs with minimized thickness which are hole transporting, due to a hole transport material which is configured for self assembly on the corresponding surface. The layers are formed by a compound made up of at least one kind of molecule according to formula (I) mixed up with a filler molecule FM given bywhere L is a linking fragment, A an anchor group and HTF is a hole transporting fragment. FM (filler molecule) is at least one kind of molecule consisting of an anchoring group, an alkyl chain of N carbon atoms, with N is in the range of 1 to 18, and a functional group of at least on of the group methyl, halogen, amino, bromide, ammonium and sulfuric functional group and where x is in the range of 0.02 to 1 and y equals (1-x).
Owner:KAUNO TECHNOLOGIJOS UNIVTAS +1
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