82results about How to "Improve inspection reliability" patented technology

In order to sample microorganisms in a first isolator 1 before, during, and after the operation of a filling system 4, first and second robots 6 and 7 that are provided in the first isolator 1 carry a sampling apparatus 5 to first and second sampling positions A and B to sample naturally dropping microorganisms, carry the sampling apparatus 5 to a third sampling position C to sample microorganisms floating around a filling nozzle 17b, and sample microorganisms adhering to the surfaces of the predetermined filling nozzle 17b and a cap feeder 18b at fourth and fifth sampling positions D and E, respectively. Since handling means is provided in a working chamber, it is possible to prevent an operator from causing contamination in the working chamber and sample microorganisms without any manual operations.

The invention discloses a method for checking the reality of an ocean color remote sensing product. The method comprises the following steps: (1) reconstructing a long time sequence remote sensing data set; (2) computing and integrating based on the time-space variation characteristics of the remote sensing data set; (3) carrying out quality control and screening on a practical measurement data set for checking the remote sensing product; (4) checking generation of data sets by practical measurement-remote sensing data based on a time-space matching rule; (5) carrying out risk level division on the eligible matched data sets; and (6) computing indexes for checking the data reality of the remote sensing product. According to the method, the representativeness and the reasonability between the remote sensing product data and the checking practical measurement data can be checked, the matched data sets are screened and generated, and an evaluation method for different risk levels is obtained, so that the evaluation results are diversified and reasonable, the uncertain risk in the checking process is lowered, and the checking credibility is improved.

An object of the present invention is to protect exposed inspection pads with a conductive tape when the application of resin is ceased and to enhance the reliability of the inspection pads. A liquid crystal display device is provided with a transparent electrode formed on a superficial side of a CF board, a grounded electrode, an inspection pad and a switching device between the inspection pad and a signal line or a scanning line respectively formed in a terminal area a TFT board and a conductive tape that electrically connects the transparent electrode of the CF board, the grounded electrode and the inspection pad respectively of the TFT board.

An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the probes by using the tip position detecting device, detecting the tip positions of the probes, previously detected by the tip position detecting device, by using the second imaging unit, transferring needle marks of the probes onto a soft member provided at the tip position detecting device by allowing the probes to come into contact with the soft member, detecting the needle marks of the probes formed on the soft member by using the first imaging unit, and detecting inspection electrodes of the object corresponding to the probes by using the first imaging unit.

A method of inspecting a substrate is disclosed. The method is performed by a substrate-inspecting apparatus having at least one projecting module projecting a patterned light onto a substrate fixed on a stage and an inspecting module with a camera capturing an image, and inspecting a plurality of inspection regions of the substrate step by step. The method comprises, setting an inspection order of the inspecting regions according to a lengthwise direction of the substrate, estimating height displacement of a target inspection region by using a tendency information regarding at least one previous inspection region that is already inspected, adjusting height of the inspecting module by using the estimated height displacement of the target inspection region, and inspecting the target inspection region by using the inspecting module of which height is adjusted. Therefore, inspection time is reduced.

The invention discloses a generation method of a vibration environment long life test spectrum of a converter of electric multiple units. The generation method comprises following steps of: obtaining a vibration environment standard spectrum according to vibration data of a converter installed on electric multiple units; calculating a root mean square value g1 of the vibration environment standard spectrum according to the vibration environment standard spectrum; calculating an accelerated speed proportion coefficient beta according to the total life running distance L of the electric multiple units, the average running speed V of the electric multiple units, the test time T and an index m through a formula: beta = (L / V*T) 1 / m; calculating a root mean square value g2 of the vibration environment long life test spectrum according to the accelerated speed proportion coefficient beta and the root mean square value g1 of the vibration environment standard spectrum through a formula: g2 = beta*g1; and calculating the vibration environment long life test spectrum according to the root mean square value g2 of the vibration environment long life test spectrum. In this way, the accurate vibration environment long life test spectrum a can be obtained and improvement of detection reliability is facilitated.

A leak inspection device comprises: a vacuum chamber 2 for accommodating a product 1; a vacuum pump 3 for discharging air from the vacuum chamber; a He gas bomb 4 for supplying and charging He gas into the product; and a leak detector 5 for detecting He gas which has leaked out from the product, wherein a heater 8 is provided on an outer wall of the vacuum chamber and an inner surface temperature of the vacuum chamber is maintained to be higher than the temperature of the outside air. Due to the above constitution, moisture contained in the atmosphere is not attached onto the inner surface of the vacuum chamber.

The invention discloses a method for detecting the state of a tuning area of an uninsulated frequency-shift automatic block system, relating to a method for detecting the state of a tuning area of a track circuit. The method is designed for solving the problem that the detection on the state of a tuning area of the existing electrical resonant uninsulated frequency-shift automatic block system can not be realized. The method comprises the following steps: a transmitting apparatus sends voltage signals to a transmitting matching transformer FBP, and the matching transformer FBP carries out matching transformation on the voltage signals and then inputs the voltage signals to an uninsulated track; a receiving matching transformer JBP acquires a track surface voltage of a receiving end, carries out matching transformation on the track surface voltage, and then outputs the track surface voltage to a receiving apparatus; the receiving apparatus carries out filtering separation on the signals so as to obtain a tuning area voltage signal and a main track voltage signal; and the tuning area voltage signal is compared with the main track voltage signal so as to realize the detection on the state of the tuning area of the uninsulated track circuit. The method disclosed by the invention is suitable to be applied to the detection on state of the tuning area of the uninsulated frequency-shift automatic block system.

A probe apparatus 10 comprises a probe card 13, a main chuck 12, an X-stage 14 and a Y-stage 15. A vertical drive mechanism 18 is provided such that an extension line from a center for inspection of the probe card 13 coincides with an axis of the vertical drive mechanism. A static-pressure thrust air bearing 19, which is coaxial with the vertical drive mechanism 18 and vertically drives a main chuck 12, is provided as a vertically movable member. A gap-maintaining means 23 is provided to maintain a gap at a constant size between the static thrust air bearing 19 and the main chuck 12.

A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.

An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the probes by using the tip position detecting device, detecting the tip positions of the probes, previously detected by the tip position detecting device, by using the second imaging unit, transferring needle marks of the probes onto a soft member provided at the tip position detecting device by allowing the probes to come into contact with the soft member, detecting the needle marks of the probes formed on the soft member by using the first imaging unit, and detecting inspection electrodes of the object corresponding to the probes by using the first imaging unit.

The embodiment of the invention discloses an authentication and authorization method, a tax-related business platform, a tax bureau front-end system, an anti-fake tax control device and a tax-related system, in order to improve the test reliability and validity of the authentication and authorization. The method disclosed by the embodiment of the invention comprises the following steps: the tax-related business platform obtains authorization information comprising a PIN code of the anti-fake tax control device of a tax user, and the tax-related business platform obtains a private key and then performs signature on preset information according to the private key to obtain an encryption factor; the tax-related business platform calls an interface of the anti-fake tax control device according to the PIN code and sends the encryption factor to the anti-fake tax control device through the interface of the anti-fake tax control device; the tax-related business platform obtains signature data sent by the anti-fake tax control device so as to send the signature data to the tax bureau front-end system; and thus, the tax-related business platform obtains authorization success information sent by the tax bureau front-end system. Management and control are performed by the encryption factor and the private key, thereby improving the reliability of testing whether the tax-related business platform is authorized by the tax user and ensuring the validity of the authorization of the tax user of the anti-fake tax control device to the tax-related business platform.

A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.

The present invention includes a fritting circuit applying a voltage between a probe pair composed of probes in pairs in contact with a substrate to cause a fritting phenomenon to establish an electrical conduction between at least one of the probe pair and the substrate; and a switching circuit electrically connecting the probe pair and the fritting circuit and capable of freely switching between polarities of a voltage applied between the probe pair. Voltage is applied twice between the probe pair in contact with the substrate to thereby perform fritting twice. In the two times of fritting, the polarities of the voltage applied between the probe pair are changed. According to the present invention, electrical conduction between the probes and the substrate can be obtained more stably.

Disclosed are an integrated drug management system and a method of providing prescription drugs by using the same. The integrated drug management system includes a drug information managing module to manage a basic information and a pattern information of an individual drug by performing an image processing scheme for the individual drug, an integrated management control module to control a drug management work and a prescription drug management work, a prescription drug making module to provide the drug by preparing a drug according to a prescription information, a prescription drug inspecting module to inspect a defect state of the drug, a prescription drug reinspecting module connected to the integrated management control module to reinspect the defect state of the drug which has been determined as a defective drug, and a drug pack providing module to provide a drug pack to each ward or each patient.

A support block is provided with a plurality of through holes for supporting probes. The probes for signals, for power supply and for grounding are secured in the through holes of the support block and electrically interconnect electrode terminals of a device to be inspected, which is provided on one face side of the support block, and wiring terminals connected t an inspection unit, which is provided on the other face side of the support block. A device guide is integrally formed with or separately fixed to the one face side of the support block, and includes an opening having a square shape in a plan view for guiding the device to be inspected. A centering mechanism adjusts a position of the device to be inspected at a center position of the opening of the device guide.

An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable contact body belonging to the sensor unit, the method used in inspecting electrical characteristics of an object to be inspected by bringing the object supported on a movable mounting table into electrical contact with the probes. The method includes a first step for moving the tip position detecting device by using the mounting table to thereby bring the contact the object into contact with the tips of the probes; a second step for further moving the mounting table to thereby move the contact body toward the sensor unit without causing elastic deformation to the probes; and a third step of determining a movement starting position of the contact body as the tip positions of the probes.

Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.

Processing signals acquired during guided wave testing A method of processing signals acquired during guided wave testing of an elongate member (2), such as a pipe, in which at least one guided wave (7) is generated in the elongate member, the at least one guided wave is reflected by reflectors (8) in the elongate member and reflected guided waves (9) are detected. The method comprises determining at least one reflection coefficient or a parameter for calibrating a guide wave test in dependence upon reflections from the reflectors which include at least one multiple reflection. The reflections may include a single reflection from a first reflector, a single reflection from a second reflector and a multiple reflection from the first and second reflectors.

A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint region at an outside of an end of the lead of the semiconductor device, capturing an image of the estimated solder joint region, calculating a height of solder joint in the estimated solder joint region by using the captured image of the estimated solder joint region, and determining whether the solder joint is defective by comparing the height of the solder joint in the estimated solder joint region with a reference height of a solder joint, which is previously set. According to the method, reliability of inspection is enhanced regardless of environmental noises.

An inspection apparatus includes a fritting circuit applying a voltage between a probe pair composed of probes in pairs in contact with a substrate to cause a fritting phenomenon to establish electrical conduction between the probes and the substrate; and a switching circuit electrically connecting the probe pair and the flitting circuit and capable of freely switching between polarities of a voltage applied between the probe pair. Voltage is applied twice between the probe pair in contact with the substrate to thereby perform fritting twice. In the two times of fritting, the polarities of the voltage applied between the probe pair are changed.

Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image.

The invention discloses a digital signal discriminator and a use method thereof. The device comprises a base. The outer wall of the top of the base is clamped with an outer cover. The inner wall of the top of the base is clamped with a circuit board. The outer wall of one side of the base is provided with an opening. The inner wall of the through hole is clamped with a digital signal output end and a digital signal loading end, wherein the digital signal output end and the digital signal loading end are connected with the output end and the input end of the circuit board respectively. The method comprises the steps that phase information is acquired through digital phase demodulation; digital discrimination is realized through phase differentiation; and an A / D converter directly samples anintermediate frequency analog signal. According to the invention, the structure design is reasonable; the flow is clear; the intermediate frequency analog signal is input, and finally a high frequency analog signal is simulated and output; signal sampling is extracted and output; the overall process is unified; intermediate frequency transits to low frequency and high frequency; the analog signalis converted into a digital signal, which can improve the test reliability; and compared with intermediate frequency and high frequency analog signals, the digital signal simply needs simple identification.

The invention relates to a liquid crystal display module and a display detecting circuit thereof. The display detection circuit comprises a module grounding line, a circuit board grounding line, a grounding module, a circuit board testing circuit, an auxiliary detecting line and a resistor R2, wherein the module grounding line is provided on the module body; one end of the circuit board groundingline is electrically connected to one end of the module grounding line, the other end of the circuit board grounding line is provided with a grounding interface, the circuit board grounding line is provided on a flexible circuit board connected to the module body; the grounding module is electrically connected to the circuit board grounding line, the grounding module is disposed on the flexible circuit board; one end of the circuit board test circuit is electrically connected to the other end of the module grounding line, and the other end of the circuit board testing circuit is provided witha test interface. Since the chip driving interface, the test interface, and the grounding interface are all disposed on the flexible circuit board, the module function tester is easily used for detection, thereby improving the detection efficiency of the display detection circuit.

A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.

The present disclosure relates to an automatic inspection apparatus for generator turbines and a system using the same. The automatic inspection apparatus adjusts the height of an arm via a lifter, adjusts a rotating angle relative to an inspection object via a rotator, and adjusts forward or backward movement of a probe relative to the inspection object via an expansion / contraction unit while moving the arm having the probe on a rail in accordance with positions of a turbine to be inspected. Furthermore, a compression unit may be used to control contact pressure of the probe to the inspection object at a desired level to allow the probe to closely contact the inspection object, thereby preventing disturbance due to vibration of the probe. In addition, the automatic inspection apparatus has a simple and lightweight configuration so as to be easily installed or removed in a work site.