The invention discloses a
welding substrate for an electronic product. The
welding substrate comprises a base plate, wherein the base plate is provided with a metallized graph layer, the metallized graph layer is provided with a gold-
tin film layer, a
barrier layer is arranged between the gold-
tin film layer and the metallized graph layer and is a single
metal film layer or a composite
metal film layer, and the gold-
tin film layer is a gold-tin
alloy layer or is of a multi-layer structure formed by alternately compounding gold
layers and tin
layers. With the adoption of the film substrate, the graph line accuracy is high, the
surface smoothness of the film layer is good, a
chip can be directly welded and located without needing to precasting solders, the installation and locating accuracy of the
chip can be ensured, and the film substrate is suitable for photoelectric products of high-power LED (light-Emitting
Diode)
optical communication and the like. Meanwhile, according to the film substrate disclosed by the invention, the proper component proportion of gold and tin in the film substrate can be adopted according to different chips needed to be welded on the
underlay film substrate, so that the
welding performance of the chips is better.