Welding substrate for electronic product and manufacturing method of welding substrate

Abstract

The invention discloses a welding substrate for an electronic product. The welding substrate comprises a base plate, wherein the base plate is provided with a metallized graph layer, the metallized graph layer is provided with a gold-tin film layer, a barrier layer is arranged between the gold-tin film layer and the metallized graph layer and is a single metal film layer or a composite metal film layer, and the gold-tin film layer is a gold-tin alloy layer or is of a multi-layer structure formed by alternately compounding gold layers and tin layers. With the adoption of the film substrate, the graph line accuracy is high, the surface smoothness of the film layer is good, a chip can be directly welded and located without needing to precasting solders, the installation and locating accuracy of the chip can be ensured, and the film substrate is suitable for photoelectric products of high-power LED (light-Emitting Diode) optical communication and the like. Meanwhile, according to the film substrate disclosed by the invention, the proper component proportion of gold and tin in the film substrate can be adopted according to different chips needed to be welded on the underlay film substrate, so that the welding performance of the chips is better.

Description

technical field [0001] The present invention relates to the field of microelectronics and optoelectronic products, in particular to substrate substrates used for photoelectric communication, high-power lasers and LED circuit modules, soldering substrates for electronic products prepared by thin-film technology as solders, and soldering substrates for electronic products. Preparation. Background technique [0002] In the manufacturing process of high-power microelectronic devices, the function of the product is getting stronger, the integration is getting higher and higher, the size is getting smaller and smaller, the power density is getting higher and higher, and the heat dissipation problem is becoming more and more prominent and becomes the bottleneck of the product. Considering the large heat generated by the chip during operation, its structure needs to have a good heat dissipation channel, which is usually established by brazing the chip on the shell with a solder allo...

AI Technical Summary

Problems solved by technology

[0003] In recent years, the optoelectronic communication market has shown a rapid growth trend, and the technical requirements are getting higher and higher. For example, in the field of high-end optical communication, the mounting and positioning accuracy of chips is required to be controlled at the micron level, and prefabricated solder and printing methods are used to prepare The accuracy of the solder pattern cannot be satisfied. The coating process and prefabricated solder can only produce alloys with a fixed ratio, and only thicker alloys can be produced. When installing the chip, the coating process must first manually coat the solder on the substrate, and then apply it For chip soldering, the process is complicated and the control accuracy of the amount of solder is low. The prefabricated solder has a low accuracy of the solder pattern due to the thick alloy solder, which leads to low soldering positioning accuracy of the chip.

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