A soldering substrate for electronic products and its preparation method

Abstract

The invention discloses a welding substrate for electronic products, which comprises a substrate, a metallized pattern layer is arranged on the substrate, a gold-tin thin film layer is arranged on the metallized pattern layer, and a gold-tin thin film layer is arranged between the gold-tin thin film layer and the metallized pattern layer. The barrier layer is a single-layer metal film layer or a composite metal film layer; the gold-tin thin film layer is a gold-tin alloy layer, or a multilayer structure in which gold layers and tin layers are alternately compounded. The film substrate of the present invention has high graphic line precision and good surface flatness of the film layer, and can directly solder and position the chip without prefabricated solder, can ensure the installation and positioning accuracy of the chip, and is suitable for optoelectronic products such as high-power LED optical communications. At the same time, the ratio of the amount of gold and tin in the film substrate of the present invention can be adjusted according to the difference of the chip to be welded on the substrate film substrate, so that the soldering performance of the chip is better.

Description

technical field [0001] The present invention relates to the field of microelectronics and optoelectronic products, in particular to substrate substrates used for photoelectric communication, high-power lasers and LED circuit modules, soldering substrates for electronic products prepared by thin-film technology as solders, and soldering substrates for electronic products. Preparation. Background technique [0002] In the manufacturing process of high-power microelectronic devices, the function of the product is getting stronger, the integration is getting higher and higher, the size is getting smaller and smaller, the power density is getting higher and higher, and the heat dissipation problem is becoming more and more prominent and becomes the bottleneck of the product. Considering the large heat generated by the chip during operation, its structure needs to have a good heat dissipation channel, which is usually established by brazing the chip on the shell with a solder allo...

AI Technical Summary

Problems solved by technology

[0003] In recent years, the optoelectronic communication market has shown a rapid growth trend, and the technical requirements are getting higher and higher. For example, in the field of high-end optical communication, the mounting and positioning accuracy of chips is required to be controlled at the micron level, and prefabricated solder and printing methods are used to prepare The accuracy of the solder pattern cannot be satisfied. The coating process and prefabricated solder can only produce alloys with a fixed ratio, and only thicker alloys can be produced. When installing the chip, the coating process must first manually coat the solder on the substrate, and then apply it For chip soldering, the process is complicated and the control accuracy of the amount of solder is low. The prefabricated solder has a low accuracy of the solder pattern due to the thick alloy solder, which leads to low soldering positioning accuracy of the chip.

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