The invention relates to the technical field of
electronics, and discloses an
electromagnetic shielding film, a circuit board, and a preparation method of the
electromagnetic shielding film. The
electromagnetic shielding film comprises a plurality of convex particles, a first shielding layer, N second shielding
layers, a third shielding layer, and an
adhesive film layer, wherein the first shielding layer, N second shielding
layers, the third shielding layer, and the
adhesive film layer are successively stacked. The side, which is close to the
adhesive film layer, of the first shielding layer is set as a non-flat surface. The convex particles are distributed between the first shielding layer and the second shielding layer and between the second shielding layer and the third shielding layer.The side, which is close to the adhesive film layer, of the third shielding layer is a non-flat surface. The non-flat surface of the third shielding layer can pierce the adhesive film layer and is connected with the
ground layer of the circuit board when the electromagnetic shielding film is laminated with the circuit board.
Ground failure caused by the fact that the conductive particles of the adhesive film layer are pulled apart when the adhesive film layer of the existing electromagnetic shielding film is expanded at high temperature is avoided. The connection of the electromagnetic shielding film and the
ground layer of the circuit board is ensured.