Shielding device and manufacturing method thereof

Abstract

The invention provides a shielding device and a manufacturing method thereof. The shielding device comprises a cover and a frame, wherein the cover is provided with a top which is provided with at least one projected joint part projecting towards the frame; the frame is provided with a top and a side edge which downwards extends from the top, the top is provided with at least one joint interface corresponding to the projected joint parts of the cover, and the peripheral outline of each joint interface is the same as the peripheral outline of the corresponding projected joint part; and the projected joint part of the cover is jointed with the corresponding joint interface of the frame in an interference extrusion way to form an assembling structure of the cover and the frame. With the shielding device and the manufacturing method thereof, no side edge of the cover needs to be manufactured, thus the side edge space of the shielding device is prevented from being occupied, the cost of materials for manufacturing the side edge of the cover is saved, and zero fit-up gap is realized between the cover and the frame so that the grounding property and the shielding property of the shielding device are ensured.

Description

technical field [0001] The present invention relates generally to an electromagnetic interference (EMI) shielding device and method of manufacture thereof, and more particularly to a shielding device suitable for providing electromagnetic interference shielding for one or more electrical components on a substrate and methods of making the same method. Background technique [0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art. In normal operation, electronic / electrical components in equipment often generate undesired electromagnetic energy that can interfere with the operation of adjacent electronic / electrical components due to EMI transmission through radiation. In order to eliminate or at least mitigate the adverse effects caused by EMI, shielding enclosures / devices may be used to provide EMI shielding for electronic / electrical components. [0003] A common conventional shield has a t...

AI Technical Summary

Problems solved by technology

[0006] In the above structure, since the buckle or protrusion is located on the side of the cover of the shielding case and the side of the corresponding frame, after the cover and the frame are assembled, the side of the cover needs to partially overlap with the side of the frame so that the card snaps or tabs, thus occupying space on the sides of the shield when assembled

Moreover, although a plurality of buckles or protrusion structures are arranged on the side of the cover and the side of the frame, after the cover is engaged with the frame, there will still be an assembly gap between the buckles and the protrusions. Especially for the snap-fit ​​connection of multiple buckles and protrusions, it is difficult to ensure a good fit at each snap position, and poor fit may occur at some buckles or protrusions, which may increase the Assembly gap, so it is difficult to achieve zero assembly gap at the junction of the assembled cover and frame, and the existence of these assembly gaps will weaken the grounding and shielding performance of the shield, which may cause PF leakage

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