The invention discloses a high-stability packaging
lead frame, a packaging part production method and a packaging
lead frame, and the packaging
lead frame comprises a
lead bonding pad, a wiring groove, a slide holder, a wiring
assembly, a bonding groove, a
silver paste sheet, a bonding sheet and a protection
assembly, and the end surface of the
lead bonding pad is provided with the protection
assembly. A slide holder is welded and mounted on one side of the top end surface of the
lead bonding pad, a bonding groove is formed in the center of the end surface of the slide holder, a
silver paste sheet is arranged on the end surface of the bonding groove, and a bonding sheet is fixedly mounted in the center of the end surface of the
silver paste sheet; according to the invention, the packaginglead frame is stable in structure and good in heat dissipation effect; the wiring pins are subjected to modular
processing, so that the pins can be mounted according to use requirements, the mountingis convenient, the connection is firm, and the electrical
conductivity is good; meanwhile, in the production process of the packaging piece, the process is simple, stress in the packaging piece can beeffectively eliminated, the optical detection effect of a finished product is good, and the situation of optical detection errors can be effectively reduced.