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56results about How to "Cross-sectional area" patented technology

Chip structure and process for forming the same

A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer. The second built-up layer is provided with a second dielectric body and a second interconnection scheme, wherein the second interconnection scheme interlaces inside the second dielectric body and is electrically connected to the first interconnection scheme. The second interconnection scheme is constructed from at least one second metal layer and at least one via metal filler, wherein the second metal layer is electrically connected to the via metal filler. The thickness, width, and cross-sectional area of the traces of the second metal layer are respectively larger than those of the first metal layers.
Owner:QUALCOMM INC +1

Insulated cable

The invention relates to insulated submarine cables including conductive cores (3a, 3b) and insulating material (5a, 5b) surrounding the conductive cores (3a, 3b). Such an insulated cable includes a first length and a second length. The cable has a roughly constant core (3a) cross-sectional area A1 and a roughly constant insulating material (5a) thickness T1 along the first length, and a different roughly constant core (3b) cross-sectional area A3 and / or a different roughly constant insulating material (5b) thickness T2 along the second length. The cable may include one or more other lengths which join the first length and the second length to one another.
Owner:JDR CABLE SYST

Electric-power conversion apparatus

There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case. Along a current-flowing direction, the fuse portion includes an upstream-side first step portion whose cross-sectional area is smaller than that of the portion at the upstream side thereof, a second step portion whose cross-sectional area is smaller than that of the upstream-side first step portion, and a downstream-side first step portion whose cross-sectional area is larger than that of the second step portion but is smaller than that of the portion at the downstream side thereof.
Owner:MITSUBISHI ELECTRIC CORP
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