56results about How to "Avoid thermal interference" patented technology

An integrated overhead console assembly for a vehicle includes a camera module for taking a forward image of a vehicle in a direction of travel, a multi-display unit for displaying an image taken by the camera module, and various functional operation components of the vehicle that are efficiently incorporated in a single overhead console assembly to improve user convenience.

A heating crucible which generates heat when electricity is supplied and an insulating reflector having a shape surrounding and covering the crucible is combined.

There is described a medical examination and / or treatment apparatus with an electromagnet for generating a magnetic field for navigating a medical instrument and an x-ray device having an x-ray source and an x-ray detector attached to a bracket for visual control during the navigation, with the x-ray source and the x-ray detector being arranged on the electromagnet embodied as a hollow cylinder, on the front ends of which are located two ring coils which are arranged in parallel, between which a number of saddle coils arranged in the peripheral direction are arranged, with the hollow cylinder being arranged on a bracket which can be moved about a number of axes.

A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the fist surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.

A recording element substrate includes a substrate; an insulating layer disposed on the substrate; a plurality of heating portions which are arranged on the insulating layer and which produce thermal energy used to eject a liquid; and a plurality of heat conduction members, each being located between adjacent heating portions with respect to an arrangement direction of the heating portions, the heat conduction members being located between the substrate side principal surface of the insulating layer and the heating portion side principal surface of the insulating layer and having higher thermal conductivity than the insulating layer. The heat conduction members are in contact with a heat conduction layer which has higher thermal conductivity than the insulating layer.

An array optical sub-assembly includes a base seat, an integrated circuit, a transparent substrate and a photoelectric element. The integrated circuit and the photoelectric element are bonded respectively to the base seat and the transparent substrate. The base seat and the transparent substrate form a sealed space to protect the elements. The photoelectric element and the integrated circuit are separated to avoid thermal interference between the photoelectric element and the integrated circuit. Therefore total performance is increased and fabrication difficulty is reduced.

A phase-change random access memory (PCRAM) device and a method of manufacturing the same. The PCRAM device includes memory cells that each include a semiconductor substrate having a switching element, a lower electrode formed on the switching element, a phase-change layer formed on the lower electrode, and an upper electrode formed on the phase-change layer; and a porous insulating layer arranged to insulate one memory cell from another memory cell of the memory cells.

The present application discloses a low-noise computer heat dissipation device, which relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as a server, a network device, a personal computer (PC), a notebook computer, etc. The computer heat dissipation device comprises a heat conduction member, a central radiator, and auxiliary heat dissipation fans. The heat conduction member is mainly formed by heat pipes, evaporation ends of the heat pipes are connected to main heating members inside a chassis, condensation ends of the heat pipes are connected to the central radiator, and the central radiator has cooling fins with large heat dissipation areas and a low-speed fan. The advantages of this technical solution are that noise of heat dissipation fans of the chassis can be reduced and the overall heat dissipation efficiency can be enhanced.

A phase change memory (PCM) is provided which includes a substrate, a plurality of bottom electrodes, a plurality of top electrodes, a plurality of phase change materials, and a plurality of thermal disturbance-preventing parts. The bottom electrodes are disposed in the substrate, and the top electrodes are disposed on the substrate. The phase change (PC) materials are disposed between the top and bottom electrodes, and each of the PC materials is conducted with one of the top electrodes and one of the bottom electrodes. The thermal disturbance-preventing parts are utilized to reduce the effect of thermal disturbance upon the PCM.

An information recording method enables the precise formation of a recording mark on a recording layer having a high light transmittance such as an L1 layer of a double-layered optical recording medium. The information recording method uses the following recording strategy. A laser beam is pulse-modulated so as to create a pulse series including a write pulse of a recording power and a cooling pulse of a base power. Data to be recorded is modulated to have a length of a recording mark along a track of the recording layer. At the same time, the length of the recording mark is made to correspond to an integral multiple nT of T where T is one clock cycle. An nT recording mark corresponding to nT is recorded by using the same number of write pulses and cooling pulses when n is 4 or larger. Moreover, an average width AveTc for a single cooling pulse width Tc is set to satisfy: 1.0<AveTc / T<1.6 and a total pulse width SumTc of the used cooling pulses is set to satisfy: 0.5≦SumTc / nT≦0.8.

The invention provides a coil panel which comprises a coil panel support (4) and a coil (5), wherein the coil panel support (4) is provided with a first surface and a second surface which are arranged in a back-to-back mode, and the coil (5) is wound around the first surface and the second surface of the coil panel support. The invention further provides an assembling method of the coil panel, the coil panel support and an electromagnetic range. Due to the fact that the coil is wound around the two surfaces of the coil panel support, the length of the coil is doubled in the same area, and correspondingly, the thermal efficiency of the coil panel and the thermal efficiency of the electromagnetic range provided with the coil panel can be improved substantially. Besides, due to the fact that the coil portion on the upper surface and the coil portion on the lower surface are separated by the coil panel support, not only can thermal interference between the coil portion on the upper surface and the coil portion on the lower surface be avoided, but also electric interference between the coil portion on the upper surface and the coil portion on the lower surface can be avoided.

The invention provides a coil panel which comprises a coil panel support (4) and a coil (5), wherein the coil panel support (4) is provided with a first surface and a second surface which are arranged in a back-to-back mode, and the coil (5) is wound around the first surface and the second surface of the coil panel support (4). The invention further provides an assembling method of the coil panel, the coil panel support and an electromagnetic range. Due to the fact that the coil is wound around the two surfaces of the coil panel support, the length of the coil is doubled in the same area, and correspondingly, the thermal efficiency of the coil panel and the thermal efficiency of the electromagnetic range provided with the coil panel can be improved substantially. Besides, due to the fact that the coil portion on the upper surface and the coil portion on the lower surface are separated by the coil panel support, not only can thermal interference between the coil portion on the upper surface and the coil portion on the lower surface be avoided, but also electric interference between the coil portion on the upper surface and the coil portion on the lower surface can be avoided.

A method of recording data on a double-layer optical recording medium having a recording layer with high light transmittance is provided. A laser beam is modulated to emit a pulse series of laser including a write pulse of a write power and a cooling pulse of a bottom power, so as to encode and write data to be recorded as recording marks of a length nT along a track of the recording layer, where n is an integer and T is one clock cycle. An nT recording mark is formed using (n-1) write pulse(s), and when forming a recording mark of 4 T or longer, a cooling pulse with a pulse width of 0.8 T to 2 T is inserted before the last write pulse. Recording marks are thereby accurately formed without heat interference between consecutive recording marks and cross erase between recording marks of adjacent tracks.

The invention discloses a heating assembly for peritoneal dialysis. The heating assembly for peritoneal dialysis is provided with a silica gel heating sheet; the silica gel heating sheet is provided with a first heating component and a second heating component; the middle part and / or the secondary middle part of the silica gel heating sheet are / is provided with hole sites; the hole site penetratesthrough the first heating component and the second heating component; a metal heat conduction plate is arranged above the silica gel heating sheet; the hole sites lead to the surface of the middle part and / or the secondary middle part of the metal heat conduction plate to form mounting sites; and the mounting site is provided with a thermal protector and / or a temperature sensing chip. The heatingassembly for peritoneal dialysis is provided with the heating components with different resistance values, and the control circuit starts the heating components with the corresponding voltage resistance values according to different power supply voltages, so that the heating assembly for peritoneal dialysis is separated from a power adapter to be independently used, the economic expenditure for purchasing the power adapter is reduced, and the carrying weight is reduced.

A phase-change random access memory (PCRAM) device includes a semiconductor substrate; switching elements formed on the semiconductor substrate; a plurality of phase-change structures formed on the switching elements; and heat absorption layers buried between the plurality of phase-change structures, wherein the plurality of phase-change structures are insulated from the heat absorption layers.

A phase-change random access memory (PCRAM) device includes a semiconductor substrate; switching elements formed on the semiconductor substrate; a plurality of phase-change structures formed on the switching elements; and heat absorption layers buried between the plurality of phase-change structures, wherein the plurality of phase-change structures are insulated from the heat absorption layers.

The invention provides a self-heating phase-change storage unit and a self-heating phase-change storage structure. The self-heating phase-change memory unit includes a self-heating electrode and a phase-change storage medium connected with the self-heating electrode; the self-heating electrode comprises at least one self-heating material layer; the phase-change storage medium comprises at least one layer phase-change storage material layer; the self-heating material layer and the phase-change storage material layer are made of different materials; and the self-heating material layer and the phase-change storage material layer each comprise at least one chalcogen element. The self-heating phase-change storage unit of the invention has fast data writing capability and a low-power consumptioncharacteristic; and thermal interference between adjacent self-heating phase-change storage units can be effectively avoided. The self-heating phase-change structure of the invention has the advantages of very high data writing speed, strong data retention capability, low power consumption, long service life and the like.

The invention provides a coil panel which comprises a coil panel support (4) and a coil (5), wherein the coil panel support (4) is provided with a first surface and a second surface which are arranged in a back-to-back mode, and the coil (5) is wound around the first surface and the second surface of the coil panel support. The invention further provides an assembling method of the coil panel, the coil panel support and an electromagnetic range. Due to the fact that the coil is wound around the two surfaces of the coil panel support, the length of the coil is doubled in the same area, and correspondingly, the thermal efficiency of the coil panel and the thermal efficiency of the electromagnetic range provided with the coil panel can be improved substantially. Besides, due to the fact that the coil portion on the upper surface and the coil portion on the lower surface are separated by the coil panel support, not only can thermal interference between the coil portion on the upper surface and the coil portion on the lower surface be avoided, but also electric interference between the coil portion on the upper surface and the coil portion on the lower surface can be avoided.

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.

A passively cooled storage module for spent nuclear fuel includes an elongated body including a top end, bottom end, sidewall, baseplate, detachable lid, and cavity for holding a fuel canister containing heat-emitting spent nuclear fuel assemblies. Cooling air inlet ducts spaced draw ambient cooling air radially inwards into a lower portion of the cavity. The air flows upwards in the cavity along the canister and is discharged from the top end of the module to atmosphere via natural circulation. The air inlet ducts may have a multi-angled and recurving configuration comprising one or more obliquely angled sections in one embodiment. The exterior inlet end openings of the inlet ducts are arranged at a higher elevation than the interior outlet end openings to prevent the ingress of standing and flood-related waters. The ducts and lid include radiation shielding features.

The invention relates to a heat insulation device for a U-shaped pipe laying heat exchanger, which is arranged between straight tube sections of the U-shaped heat exchange pipes of the heat exchanger. The heat insulation device comprises a body, wherein an arc groove attached to the straight pipe sections of the U-shaped heat exchange pipe of the heat exchanger is axially arranged on the external wall of the body; and the body is made of a material with the coefficient of heat conductivity of between 0.02-0.06W / (m-K). Compared with the prior art, the heat insulation device has the advantages that the heat interference phenomenon generated among the straight pipe sections of the U-shaped heat exchange pipe can be avoided through setting the heat insulation device with the coefficient of heat conductivity of between 0.02-0.06W / (m-K) among the straight pipe sections of the U-shaped heat exchange pipe of the heat exchanger, on the premise that the effective heat exchange area of the U-shaped pipe is not reduced, through ensuring the distance between two pipes of the U-shaped pipe and applying a high thermoresistance recharge material, the amount of heat exchange of the U-shaped pipe is improved by about 15 percent.