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Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head

一种记录元件、基板的技术，应用在印刷等方向，能够解决不能散热、喷墨定时偏移、温度增加等问题，达到可靠性高的效果

Inactive Publication Date: 2010-09-29
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When high-speed recording is performed using this head substrate, even if the heat conduction layer 35 is provided in the second interlayer insulating layer as disclosed in Japanese Patent Laid-Open No. Down to the area where the heat conduction layer 35 is located, there is a possibility that heat dissipation cannot be efficiently performed
If heat dissipation cannot be performed efficiently, thermal interference between adjacent heating sections in densely arranged heating sections may increase the temperature of the entire substrate, causing ink ejection timing shifts and other problems, deteriorating the quality of recorded images

Method used

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  • Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head
  • Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head
  • Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head

Examples

Experimental program
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Effect test

no. 1 example

[0039] will refer to figure 2 and image 3 Examples of the present invention will be described. Such as figure 2 As shown, on a Si substrate 1 provided with active elements (active elements) (not shown) such as transistors, SiO doped with boron or phosphorus with a thickness of 500 nm is provided. 2 Formed interlayer film 2. On the interlayer film 2, a heat conduction layer 4 made of an Al-Si alloy and an electrode layer 4a having a thickness of 400 nm are provided. On the thermal conduction layer 4 and the electrode layer 4a, a layer made of SiO with a thickness of 1 μm is set. 2 The insulating layer 5 is formed. The insulating layer 5 also functions as a heat storage layer that stores the heat of the heating portion 12 . A heating portion 12 made of TaSiN with a thickness of 50 nm was provided on the insulating layer 5 . Both ends of each heating unit 12 are in contact with the electrodes 10 . The electrode 10 is in contact with the electrode layer 4 a via a contac...

no. 2 example

[0055] Figure 7A and Figure 7B An example according to the second embodiment of the present invention is shown. Except for the shape of the heat conduction member 11, the structure and manufacturing method of the second embodiment are the same as those of the first embodiment, and therefore, repeated descriptions will be omitted. As shown in the first embodiment, by setting as figure 1 The heat conducting member 11 shown prevents thermal interference. In the case where a higher speed is required, it can be adjusted by increasing the volume of the heating part 12 . However, if the distance between each heat-conducting member 11 and the heating portion 12 adjacent to the heat-conducting member 11 is too small, the insulating layer 5 cannot produce an effect as a heat storage layer, and the heat of the heating portion 12 is lost before the ink undergoes film boiling. The heat escapes to the heat conducting member 11 . Therefore, the heat conduction member 11 must be locat...

no. 3 example

[0058] Figure 8A and Figure 8B An example according to the third embodiment of the present invention is shown. Except for the shape of the heat conduction member 11, the structure and manufacturing method of the third embodiment are the same as those of the first embodiment, and therefore, repeated descriptions will be omitted.

[0059] Figure 8A and Figure 8B is shown as Figure 6 A schematic plan view of an end portion of an arrangement (arrangement) of heating portions 12 arranged at a predetermined pitch is shown. In the recording element substrate 1050, since the heating portions 12 are located at a high density in the central region, heat is stored more easily in the central region than in the end regions. When there is a temperature variation between the central region and the end regions of the recording element substrate 1050, the ink on the heating portion 12 located in the central region is burned faster than the ink on the heating portion 12 located in the...

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PUM

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Abstract

The invention provides a recording element substrate, a method of manufacturing the recording element substrate, and a liquid ejection head. The recording element substrate includes a substrate; an insulating layer disposed on the substrate; a plurality of heating portions which are arranged on the insulating layer and which produce thermal energy used to eject a liquid; and a plurality of heat conduction members, each being located between adjacent heating portions with respect to an arrangement direction of the heating portions, the heat conduction members being located between the substrate side principal surface of the insulating layer and the heating portion side principal surface of the insulating layer and having higher thermal conductivity than the insulating layer. The heat conduction members are in contact with a heat conduction layer which has higher thermal conductivity than the insulating layer.

Description

technical field [0001] The present invention relates to a recording element substrate configured to perform recording using thermal energy, a method of manufacturing the recording element substrate, and a liquid ejection head. Background technique [0002] As a thermal recording device that performs recording by heating a plurality of heating portions installed therein, a sublimation type recording device and an inkjet type recording device are known. In a sublimation type recording apparatus, recording is performed by thermally melting ink on an ink ribbon and transferring it to a recording medium, while in an inkjet type recording apparatus, ink is ejected by subjecting a liquid such as ink to film boiling method to record. In these recording devices, in order to diffuse excessive heat generated in the heating section, a substrate having high thermal conductivity is employed as a recording element substrate (hereinafter also referred to as a "head substrate"). In order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14B41J2/16
CPCB41J2/1632B41J2/1646B41J2/1643B41J2/1642B41J2/14129B41J2/1603B41J2/1408Y10T29/49401
Inventor 石田让小室博和齐藤一郎樱井诚松居孝浩
Owner CANON KK
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