The invention discloses a method for manufacturing a
metal protective film used for a film circuit test. The method includes the following steps that a
ceramic substrate plated with a TaN / TiW / Au
metal film is coated with a layer of
photoresist, and the
photoresist on the non-circuitous-pattern part of the
ceramic substrate plated with the film is removed through a photo-
etching method; a self-
adhesive gold electroplated protective film and a self-
adhesive nickel electroplated protective film are performed on the
ceramic substrate plated with the film after photo-
etching treatment, and then the
photoresist is removed; the photo-
etching method is adopted for performing photoresist
coating to protect a circuitous pattern, and an Au / TiW layer of the non-pattern part is etched; the pattern part and circuitous resistance part of the
ceramic substrate plated with the film are coated with
layers of photoresist by the adoption of the photo-etching method, and a
resistor layer of a non-photoresist-protection part is etched to form circuitous resistors; then, all the photoresist is removed, correction is performed
on resistance values of the resistors, finally, the
nickel electroplated protective film is removed through
corrosion, and a film circuit is obtained. The
machining steps of the
nickel layer
electroplating and nickel layer corroding are added, a gold strip line can be well protected from damage by a
test probe through the nickel electroplated
metal protective film,
machining quality and the finished product rate of the film circuit are improved, and manufacturing cost of the film circuit is reduced.