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1628results about "Optical based geological detection" patented technology

Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method

A drive unit drives a wafer table in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer table in the Y-axis direction and based on known correction information in accordance with position information of the wafer table in a non-measurement direction (e.g. Z, θz and θx directions) that is measured by an interferometer at the time of the measurement by the encoder. That is, the wafer table (a movable body) is driven in the Y-axis direction based on the measurement value of the encoder that has been corrected by correction information for correcting a measurement error of the encoder that is caused by a relative displacement of a head and a scale in the non-measurement direction. Accordingly, the movable body can be driven with high accuracy in a desired direction while measuring the position by the encoder, without being affected by the relative motion between the head and the scale in directions other than a direction to be measured (measurement direction).
Owner:NIKON CORP

System and method for lithography process monitoring and control

In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and / or evaluating optical lithographic equipment, methods, and / or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and / or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and / or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and / or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. In this way, the aerial image used, generated or produced to measure, inspect, characterize and / or evaluate the photomask is the same aerial image used, generated or produced during wafer exposure in integrated circuit manufacturing. In another embodiment, the system, sensor and technique characterizes and / or evaluates the performance of the optical lithographic equipment, for example, the optical sub-system of such equipment. In this regard, in one embodiment, an image sensor unit measures, collects, senses and / or detects the aerial image produced or generated by the interaction between lithographic equipment and a photomask having a known, predetermined or fixed pattern (i.e., test mask). In this way, the system, sensor and technique collects, senses and / or detects the aerial image produced or generated by the test mask—lithographic equipment in order to inspect, evaluate and / or characterize the performance of the lithographic equipment.
Owner:ASML NETHERLANDS BV
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