A method and apparatus for depositing a material layer onto a substrate is described. The method includes delivering a mixture of precursors for the material layer into a process chamber and depositing the material layer on the substrate at low temperature. The material layer can be used as an encapsulating layer for various display applications which require
low temperature deposition process due to
thermal instability of underlying materials used. In one aspect, the encapsulating layer includes one or more material
layers (multilayer) having one or more
barrier layer materials and one or more low-
dielectric constant materials. The encapsulating layer thus deposited provides reduced
surface roughness, improved water-barrier performance, reduce thermal stress, good step coverage, and can be applied to many substrate types and many substrate sizes. Accordingly, the encapsulating layer thus deposited provides good device lifetime for various display devices, such as
OLED devices. In another aspect, a method of depositing an
amorphous carbon material on a substrate at low temperature is provided. The
amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.