143 results about "Thinned array" patented technology

A process for fabricating an integrated circuit package includes establishing a plating mask on a first surface of a metal carrier. The plating mask defines a plurality of components including a die attach pad, at least one row of contact pads and at least one additional electronic component. A plurality of metallic layers are deposited on exposed portions of the first surface of the metal carrier. The plating mask is stripped from the metal carrier, leaving the plurality of metallic layers in the form of the plurality of components. A semiconductor die is mounted to die attach pad and pads of the semiconductor die are electrically connected to ones of the contact pads and to the additional electronic component. The first surface of the metal carrier is overmolded to encapsulate the plurality of components and the semiconductor die and the metal carrier is etched away.

A process for fabricating an integrated circuit package. Metal is plated up on a substrate to provide a plurality of contact pads and a plurality of fiducial markings on a periphery of the contacts. A transparent mask is selectively deposited on the substrate, over the fiducial markings. A semiconductor die is mounted on the substrate such that the contact pads circumscribe the semiconductor die and the semiconductor die is wire bonded to ones of the contact pads. The wire bonds are encapsulated and the semiconductor die and contact pads are covered in a molding material. The substrate is selectively etched to thereby etch away the substrate underneath the contact pads and the semiconductor die. The integrated circuit package is singulated from other integrated circuit packages by sawing using the fiducial markings.

Provided herein is a method for use in medical applications that permits (1) affordable three-dimensional imaging of blood flow using a low-profile easily-attached transducer pad, (2) real-time blood-flow vector velocity, and (3) long-term unattended Doppler-ultrasound monitoring in spite of motion of the patient or pad. The pad and associated processor collects and Doppler processes ultrasound blood velocity data in a three dimensional region through the use of a planar phased array of piezoelectric elements. The invention locks onto and tracks the points in three-dimensional space that produce the locally maximum blood velocity signals. The integrated coordinates of points acquired by the accurate tracking process is used to form a three-dimensional map of blood vessels and provide a display that can be used to select multiple points of interest for expanded data collection and for long term continuous and unattended blood flow monitoring. The three dimensional map allows for the calculation of vector velocity from measured radial Doppler.A thinned array (greater than half-wavelength element spacing of the transducer array) is used to make a device of the present invention inexpensive and allow the pad to have a low profile (fewer connecting cables for a given spatial resolution). The full aperture is used for transmit and receive so that there is no loss of sensitivity (signal-to-noise ratio) or dynamic range. Utilizing more elements (extending the physical array) without increasing the number of active elements increases the angular field of view. A further increase is obtained by utilizing a convex non-planar surface.