486 results about "Compression load" patented technology

A spinal intervertebral support implant, for fusion or for dynamic stabilization purposes. A rod, preferably in the form of a screw, is inserted obliquely from the pedicle of an inferior vertebra into the body of a neighboring superior vertebra, through the disc space. The rod can be anchored into the body of the superior vertebra by means of a force fit or a screw thread. A pile of elements is disposed on the rod in the disc space like a pile of washers, so that the compression load between vertebrae is carried partly by these elements. These elements can be inserted through the bore through which the rod was inserted in a tightly folded configuration, and deployed into their washer-like form only when in position in the intervertebral space, such that there is no need for any additional incisions.

A filament wound strut as well as a method of making the strut. The filament wound strut has a cylindrical section merging into ends through tapered end sections and which ends may be forked or otherwise arranged to receive a lug fitting. The flat ends are provided with a specially designed pre-form having a generally oval shape, and which is formed by filament reinforcement in a racetrack format surrounding a quasi-isotropic laminate. In accordance with this construction, the wound structure will react to tension loads and the inner laminate reacts to compression loads, while improving the load transfer through edge bearing and shear. A method of producing the strut is also provided in which filament materials are wound about a mandrel which is disassemblable and removable from the strut body formed thereon.

An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.

A light weight sandwich panel which, as a whole, has high rigidity against bending and shearing and in which a core material has high rigidity against compression. A sandwich panel comprising two resin skin material sheets and a thermoplastic resin core material sandwiched between the two resin skin material sheets and planarly adhered thereto. The thermoplastic resin core material consists of a foam resin and has openings formed in at least one surface of the core material. The openings extend inward and have recesses for forming cavities in the thermoplastic resin core material in such a manner that the cavities are closed by the skin material sheets. The number of recesses and the total area of the openings are determined in such a manner that the planar adhesion of the thermoplastic resin core material to the skin material sheets is successfully maintained and that a solid section of the foam resin of the thermoplastic resin core material effectively supports a compression load acting in the direction of the thickness of the thermoplastic resin core material.

The invention described relates to formed profiles comprising microcellular TPE foam compositions, and articles therefrom, wherein the TPE are thermoplastic vulcanizates. The foamed thermoplastic elastomer profile comprises a foamable thermoplastic elastomer composition having a) a cross-linkable hydrocarbon rubber in the presence of b) a thermoplastic polyolefin resin having a Tm greater than 120° C. wherein said composition further comprising: a) 25 to 30 wt % of a partially or fully vulcanized reaction product of said cross-linkable hydrocarbon rubber with a cross-linking agent, said reaction product being present as a dispersed phase; b) 7 to 12 wt % of said thermoplastic resin as a continuous phase; c) 8-22 wt % of an elastomeric thermoplastic modifier comprising 1) 3-7 wt. % copolymers of propylene with one or more of ethylene and C4-C10 alpha-olefins, said copolymers having a Tm greater than 20° C. and less than 120° C., and, 2) 5-15 wt. % hydrogenated, triblock styrenic copolymers from styrene and isoprene; and, optionally, d) 3-12 wt. % solid filler; and / or e) 35-45 wt. % of non-aromatic hydrocarbon oil; wherein said wt. % amounts are based upon the total weight of the composition, and where the composition has been prepared by a process comprising dynamically vulcanizing said composition. The foamed thermoplastic elastomer profiles having smooth surfaces, improved low water absorption, improved compression set and compression load deflection.

There is provided a box structure for carrying load having upper and lower composite integrated sandwich panels. The panels have facesheets sandwiching one or more core portions and adjacent dense packs oriented in an axial direction. The box structure further has a plurality of spars. Each spar has a web and web attachments and has a spar length in the axial direction. The plurality of spars are connected to the panels with the web attachments located at the dense packs. The facesheets are configured to carry primarily torsion and pressure loads in shear and no significant axial loads. The dense packs are configured to carry all significant box bending in axial tension and compression loads.