36results about How to "Reduce cable costs" patented technology

Disclosed is an optical fiber cable that includes optical fibers and a deformable coupling element enclosed within a buffer tube. The coupling element is formed from a deformable yet substantially incompressible material and features a number of raised members projecting toward the optical fibers. The design of the coupling element layer permits coupling of the optical fibers to the buffer tube without the use of a compressive cushioning layer. This arrangement distributes the compressive force applied to discrete points along the outer perimeter of the optical fiber element.

A photovoltaic generator is provided that has at least one string of multiple series-connected photovoltaic modules, each of which has a plurality of series-connected photovoltaic cells. One quarter to one half of all photovoltaic modules of the at least one string can be short-circuited by means of a switch. Activation of the switch takes place when a predefined voltage value across the string is exceeded. The shorting switch is only present in some of the arrays making up the photovoltaic generator, which reduces cabling costs. Because of the parallel connection of the arrays, the voltage of the arrays without shorting switches is drawn down to a lower voltage that is safe for the inverter.

This invention relates to a method, a system, a base station, a base station hub (41) and software applications for data transmission between at least one base station (42-1, 42-2) and a radio network controller (40) in a radio access network, said method comprising operating a first-type physical layer protocol (46) for a transmission of said data between said at least one base station (42-1, 42-2) and a base station hub (41); operating a second-type physical layer protocol (47) for a transmission of said data between said base station hub (41) and said radio network controller (40); wherein said data comprises user data (340) that is transmitted between said radio network controller (40) and said at least one base station (42-1, 42-2) via said base station hub (41); and wherein said at least one base station (42-1, 42-2) performs at least base band processing for signals that are transmitted via a radio interface (7) and represent said user data (340).

An ultrasound sensing system for monitoring the condition or integrity of a structure, comprising (a) a plurality of ultrasound sensors, each sensor being configured to receive at least one first electrical signal, transmit an ultrasound signal in response to the first electrical signal, receive at least one reflected ultrasound signal, and transmit a second electrical signal in response to the reflected ultrasound signal, the first and second electrical signals being analog; (b) at least one digital sensor interface (DSI) to which at least a portion of the sensors are connectable, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals for each sensor, the DSI having circuitry for transmitting a digital signal based directly or indirectly on at least the A-scan signal, the digital signal including an address corresponding to the at least one DSI; (c) a digital bus configured to receive the digital signal from the at least one DSI; (d) a user interface connected to the bus to receive the digital signal; and wherein, in one embodiment, the sensors are mounted semi-permanently on the structure and the DSI is also mounted semi-permanently on or adjacent to the structure being monitored.

A server system includes a rack, multiple servers, an electrically conductive component, a switch, a rack management controller and a power supply. The rack has a first storage area, a middle storage area and a second storage area. The servers are positioned in the first storage area and the second storage area. The electrically conductive component is installed inside the rack and includes a first power supply part disposed in the first storage area and a second power supply part disposed in the second storage area. The switch is installed in the middle storage area. The rack management controller is installed in the middle storage area. The power supply, installed in the middle storage area, is electrically connected to the rack management controller and the switch which is disposed farther away from the electrically conductive component than the power supply.

An optical fiber drop cable includes an optical element portion having an optical fiber core wire and a pair of first tension members disposed parallel to the optical fiber core wire on both sides thereof in a sandwiching manner. The optical fiber core wire and the pair of first tension members are coated with a cable sheath. A long-scale cable support wire portion has a second tension member coated with a sheath. The optical element portion and the cable support wire portion are adhered parallel to each other. The first tension members are composed of a nonconductive material. A flexural rigidity of the optical element portion is in a range from 80 to 500 Nmm².

The invention discloses a process for a 420-500 micron ultra-thick electrolytic copper foil. The process comprises the following steps of 1, unreeling; 2, activating; 3, pickling; 4, coarsening and curing; 5, carrying out barrier layer treatment; 6, carrying out anti-oxidation treatment; 7, carrying out organic treatment; and 8, drying and rolling. According to the process, the effect of radiatingheat generated by components outside a substrate can be achieved, so that the purpose of high-density interconnection of high-power electric appliances is achieved, the original power transmission forms such as cable wiring, metal plate bars and the like are replaced, the production efficiency is improved, and the labor-hour cost, the cost of cables and accessories, the cost of maintenance management and the like of wiring are reduced; the copper foil high-current substrate can effectively reduce the thermal load of a PCB and achieve quality homogenization, so that the reliability of a terminal complete machine product using the high-current PCB is further improved; and by adopting the high-current substrate to replace the original cable wiring form, the design freedom degree of the wiring can be improved, so that the miniaturization of the whole terminal product is achieved.

A frequency up-conversion device and a signal transmission system are provided. A frequency up-conversion device includes a first diplexer, a divider, a digital channel stacking circuit, an up-conversion mixer, and a second diplexer. The first diplexer divides a first signal into a second signal and a third signal. The digital channel stacking circuit transforms the second signal to a fourth signal. The up-conversion mixer mixes the fourth signal and an up-conversion oscillating signal to generate a fifth signal. The second diplexer receives the fifth signal and the third signal to generate a sixth signal for output.