Process for 420-500 micron ultra-thick electrolytic copper foil

Abstract

The invention discloses a process for a 420-500 micron ultra-thick electrolytic copper foil. The process comprises the following steps of 1, unreeling; 2, activating; 3, pickling; 4, coarsening and curing; 5, carrying out barrier layer treatment; 6, carrying out anti-oxidation treatment; 7, carrying out organic treatment; and 8, drying and rolling. According to the process, the effect of radiatingheat generated by components outside a substrate can be achieved, so that the purpose of high-density interconnection of high-power electric appliances is achieved, the original power transmission forms such as cable wiring, metal plate bars and the like are replaced, the production efficiency is improved, and the labor-hour cost, the cost of cables and accessories, the cost of maintenance management and the like of wiring are reduced; the copper foil high-current substrate can effectively reduce the thermal load of a PCB and achieve quality homogenization, so that the reliability of a terminal complete machine product using the high-current PCB is further improved; and by adopting the high-current substrate to replace the original cable wiring form, the design freedom degree of the wiring can be improved, so that the miniaturization of the whole terminal product is achieved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil treatment, in particular to a process for 420-500 micron ultra-thick electrolytic copper foil. Background technique [0002] Traditional automotive circuits use metal wires such as copper and aluminum to connect various components. The diameter of the metal section of the wire core is often more than 3mm, and the diameter of the entire wire (including the insulating layer) is more than 6mm. These connecting wires occupy a lot of space. It increases the limited use space of the car and increases the weight of the car itself. On the high-power printed circuit board, ultra-thick electrolytic copper foil is used instead of copper and aluminum wires to connect components. On the basis of meeting the requirements of high current, the interconnection density is hundreds of times higher than that of traditional wire connection methods, so that in limited It is possible to arrange a large...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the car has many circuits, takes up a lot of space, and the weight of the car itself is heavy, and the heat dissipation effect of high-power PCBs is currently improved by relying on wide wires, thin plates or multi-layer structures, large-area copper plating or built-in thick core layers. Copper foil layer, adding metal bottom plate (such as the use of metal-based PCB), adding heat conduction holes and other design solutions to achieve, for this we provide a 420-500 micron ultra-thick electrolytic copper foil process