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37results about How to "Narrowing of clearance" patented technology

RFID tag and method for reading the same

A RFID tag for accommodation in a narrow clearance in an electronic device and providing a predetermined communication distance even if a displacement occurs between first and second antennas. First antenna is mounted through first spacer to metal case surface and second antenna mounted to resin container surface facing the first antenna. The dielectric resin container functions as a second spacer. Only the first spacer and first antenna are accommodated in the narrow clearance between metal case and resin container, the tag can be mounted even in an electronic device with a small redundant space and small size. First antenna is shorter than second antenna so that a required communication distance may be obtained even if their relative position is changed.
Owner:HITACHI LTD

Semiconductor device and method of manufacturing the same and semiconductor device mounting structure

In a semiconductor device that is formed by joining two semiconductor elements together to oppose device layers to each other, inductor patterns for transmitting and receiving a signal and feeding a power and bumps for connecting electrically the semiconductor elements and for supporting the inductor patterns and the semiconductor elements being arranged opposedly in an electrically isolated state are provided on a surface of the device layer of at least one of semiconductor elements and an electrically insulating material is filled in a space between opposing surfaces of the semiconductor elements.
Owner:SHINKO ELECTRIC IND CO LTD

Tire mold

InactiveUS20060008547A1Superior uniformityImprove uniformityTyresBeltsAutomotive engineeringTread
It is a subject to restrict protrusion of rubber when performing molding and to mold tires of superior uniformity; and for this purpose, the tire mold in which a mold for molding a tire tread is comprised of segments partitioned in a tire circumferential direction is arranged in that segments 11, 12 comprise a plurality of pieces 21 to 25 and 31 to 35 partitioned in the tire circumferential direction, with only one 23, 33 of the pieces of the each segment 11, 12 being fixed while all other pieces 21, 22, 24, 25 and so on are movable in the tire circumferential direction.
Owner:TOYO TIRE & RUBBER CO LTD

Bicycle derailleur

An apparatus for achieving the return of a chain to a rear derailleur tension pulley more easily by means of pedaling action when the chain falls off from the tension pulley is provided. The rear derailleur is equipped with a base component, a link mechanism, a movable component, Outer Plate 20, Inner Plate 21, Guide Pulley 22, Tension Pulley 23, and Chain Return Section 32. The base component is a component which is mounted on the frame. The link mechanism is a mechanism of which one end is mounted on the base component. The movable component is a component which is mounted on the other end of the link mechanism, and which can be relatively displaced from the base component. The outer plate is a component which is mounted on the movable component so as to undulate like a see-saw. The inner plate is a component which is installed so as to face the outer plate. The guide pulley is a pulley which is mounted onto a portion on one edge of the plates, between the plates, so as to freely rotate and move in the axial direction, and which can be engaged with the chain. The tension pulley is a pulley which can be engaged with the chain, and is mounted onto a portion on the other edge of the plates, between the plates, so as to freely rotate. The chain return section is installed at a position on the inner plate which is proximal to the position at which the tension pulley is mounted, in a manner so that the clearance from the chain at this position is narrower as compared to the clearance at other positions.
Owner:SHIMANO INC

Bicycle derailleur

An apparatus for achieving the return of a chain to a rear derailleur tension pulley more easily by means of pedaling action when the chain falls off from the tension pulley is provided. The rear derailleur is equipped with a base component, a link mechanism, a movable component, Outer Plate 20, Inner Plate 21, Guide Pulley 22, Tension Pulley 23, and Chain Return Section 32. The base component is a component which is mounted on the frame. The link mechanism is a mechanism of which one end is mounted on the base component. The movable component is a component which is mounted on the other end of the link mechanism, and which can be relatively displaced from the base component. The outer plate is a component which is mounted on the movable component so as to undulate like a see-saw. The inner plate is a component which is installed so as to face the outer plate. The guide pulley is a pulley which is mounted onto a portion on one edge of the plates, between the plates, so as to freely rotate and move in the axial direction, and which can be engaged with the chain. The tension pulley is a pulley which can be engaged with the chain, and is mounted onto a portion on the other edge of the plates, between the plates, so as to freely rotate. The chain return section is installed at a position on the inner plate which is proximal to the position at which the tension pulley is mounted, in a manner so that the clearance from the chain at this position is narrower as compared to the clearance at other positions.
Owner:SHIMANO INC

Proximity sensor assembly and inspection system

A proximity sensor assembly with a sensing element having a substrate and an antenna pattern disposed on one or more planar surfaces of the substrate is disclosed. The cable is fed substantially parallel to the planar surfaces of the substrate and is attached to the side surface of the substrate, such that the cable is oriented substantially perpendicular to the direction of the electromagnetic field emitted from the sensing element.
Owner:BAKER HUGHES INC

Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus

The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.
Owner:BOE TECH GRP CO LTD

Liquid droplet discharge head and method of manufacturing the liquid droplet discharge head

InactiveUS20060214996A1Inexpensively accommodateReduce the numberInking apparatusEngineeringVoltage
A method of manufacturing a liquid droplet discharge head including nozzles that discharge liquid droplets, pressure chambers that are communicated with the nozzles and filled with liquid droplets, a diaphragm that configures part of the pressure chambers, and piezoelectric member groups that are configured by joining, to the surface of the diaphragm, piezoelectric plates that form groove portions and are processed in a matrix, with the piezoelectric member groups including piezoelectric elements that cause the diaphragm to be displaced as a result of a voltage being applied to the piezoelectric elements, the method comprising: processing the piezoelectric plates in a matrix to prepare the piezoelectric member groups; and joining the piezoelectric member groups to the diaphragm in a state where mutual boundaries of the piezoelectric member groups have been fitted together and with a predetermined clearance being disposed.
Owner:FUJIFILM BUSINESS INNOVATION CORP
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