How to Much is dissipated as heat patent retrieval - Eureka

Methods and Apparatus for Improved Heat Spreading in Solid State Lighting Systems

ActiveUS20080089069A1Reduce weightEfficient transferLighting support devicesPoint-like light sourceEngineeringLED lamp

A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with. LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

Methods and Apparatus for Improved Heat Spreading in Solid State Lighting Systems

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Owner:IDEAL IND LIGHTING LLC

Lighting device having LED light bars

InactiveUS20090185374A1Easy maintenanceEffective coolingMechanical apparatusPoint-like light sourceElectricityComputer module

A lighting device has a light-bar mount and multiple light bars. The light-bar mount is integrally formed from a board. The light bars are mounted on the light-bar mount and each light bar has a heat sink, a circuit board and multiple high-power LED modules. The heat sink is detachably mounted in the light-bar mount. The circuit board is mounted in the heat sink. The high-power LED modules are mounted on the heat sink and electrically connected to the circuit board for providing outward illumination.

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Owner:ANTEYA TECH CORP

Methods and apparatus for improved heat spreading in solid state lighting systems

ActiveUS7794114B2Efficient transferMore cost-effective retrofittingLighting support devicesPoint-like light sourceFluorescenceEngineering

A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

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Owner:IDEAL IND LIGHTING LLC

LED lighting apparatus to dissipate heat by fanless ventilation

InactiveUS20110018418A1Expand heat radiation areaImprove qualityPoint-like light sourceElectric discharge tubesHeat sinkThermal radiation

An LED lighting apparatus dissipating heat by fanless ventilation including a heat radiation housing that has a heat radiation frame provided around the body of the heat radiation housing and spaced apart from the body and also has linear heat radiation fins configured to minimize interference to air flow and to maximize the heat radiation area, thereby expanding the heat radiation area significantly and thus dissipating heat much more effectively through ventilation by natural convection without a blowing fan, and consequently, extending the life span of the LED lighting apparatus and improving its quality. The LED lighting apparatus comprises a light source part including at least one LED and a PCB used to mount the LED; and a heat radiation housing provided at the upper portion thereof with a terminal part, receiving and supporting the light source part and dissipating heat.

LED lighting apparatus to dissipate heat by fanless ventilation

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Owner:YOO +1

Lighting device having LED light bars

InactiveUS8007128B2Easy maintenanceEffective coolingMechanical apparatusLighting support devicesElectricityEffect light

A lighting device has a light-bar mount and multiple light bars. The light-bar mount is integrally formed from a board. The light bars are mounted on the light-bar mount and each light bar has a heat sink, a circuit board and multiple high-power LED modules. The heat sink is detachably mounted in the light-bar mount. The circuit board is mounted in the heat sink. The high-power LED modules are mounted on the heat sink and electrically connected to the circuit board for providing outward illumination.

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Owner:ANTEYA TECH CORP

Air conditioning system and method for high-voltage battery of vehicle

InactiveUS20150101355A1Much is dissipated as heatEfficient executionAir-treating devicesCell temperature controlHigh voltage batteryEngineering

Air conditioning system and method for a high-voltage battery of a vehicle are provided. The system includes a first heat exchanger that is disposed within a battery housing and a first blower that supplies air to the first heat exchanger. A peltier element is combined with the first heat exchanger and a first surface of the peltier element comes into contact with the first heat exchanger. A second heat exchanger is disposed in an air extraction unit of a trunk room and a second blower supplies air to the second heat exchanger, to discharge air inside the trunk room to an exterior after performing heat exchange. A cooling line operates as a coolant circulating line, and a first end of the cooling line comes into contact with a second surface of the peltier element and a second end performs heat exchange between the second end and the second heat exchanger.

Air conditioning system and method for high-voltage battery of vehicle

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Owner:HYUNDAI MOTOR CO LTD

Light-emitting heat-dissipating device and manufacturing method thereof

InactiveUS20080025023A1Heat dissipationMore heat dissipationPrinted circuit assemblingLighting support devicesComputer moduleEngineering

A light-emitting heat-dissipating device includes a substrate and at least a light-emitting package module capable of generating heat. The substrate includes at least a recess and at least one thermally conducting element disposed in the recess. The light-emitting package module is disposed on the thermally conducting element and electrically connected to the substrate of the substrate via solder joints. A manufacturing method of the light-emitting heat-dissipating device is also disclosed.

Light-emitting heat-dissipating device and manufacturing method thereof

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Owner:DELTA ELECTRONICS INC

Laptop riser

ActiveUS8746645B2Much is dissipated as heatEffective coolingStands/trestlesKitchen equipmentEngineeringSupport surface

A portable riser for supporting a laptop computer or other article at an angle to a supporting surface. The riser includes a base and lid attached to each other by a double hinge. Arc shaped legs deploy form the riser when the lid is moved from a closed position to an deployed position a position where the lid rests against the opposite side of the base. The legs are formed by deforming a sheet of flexible material that lies between the base and a cover plate. The lid and the sheet of flexible material are coupled to each other so that when the lid is moved from the closed to the deployed position, the sheet of material is deployed.

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Owner:FELLOWES INC

Seal and pressure relief for steam injection heater

ActiveUS7025338B2Prevent hotPrevent cold spotFlow mixersUsing liquid separation agentSteam pressureEngineering

A direct contact steam injection heater is placed directly in line with a flow of stock through a pipe. The steam injection heater includes a Mach diffuser having a plurality of steam diffusion holes and an adjustable steam-plug cover that is positioned within a stationary diffuser tube to modulate the amount of steam added to the flowing stock by exposing a desired number of steam diffusion holes. The steam tube assembly includes an O-ring that forms a seal along the inner wall of the diffuser tube to prevent the flow of stock into the steam tube assembly when steam pressure is not present. Select areas of the steam injection heater, including the deflection plate, diffuser tube and heater body inner wall are coated with a wear coating such as tungsten carbide. Further, a pair of pressure ports are formed in the steam-plug cover to equalize the pressure between the open interior of the steam-plug cover to further facilitate rotation of the steam-plug cover.

Seal and pressure relief for steam injection heater

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Owner:HYDRO THERMAL

Heat sink

InactiveUS20080251239A1Lower base resistanceImproved heat radiation characteristicSemiconductor/solid-state device detailsSolid-state devicesEngineeringHeat pipe

A heat sink, wherein a plurality of heat radiation fins are mounted on a base plate to which an electron device is attached in a heat transmittable manner. The heat radiation fins are erected vertically and in parallel with each other on the reverse face of the base plate to which the electron device is contacted, and extended laterally from the base plate. The heat sink of the invention comprises a heat pipe for transporting heat between the extended portion of the heat radiation fins and the base plate.

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Owner:THE FUJIKURA CABLE WORKS LTD

Laptop riser

ActiveUS20100219320A1More heat dissipationEffective coolingStands/trestlesKitchen equipmentSupport surfaceLaptop

A portable riser for supporting a laptop computer or other article at an angle to a supporting surface. The riser includes a base and lid attached to each other by a double hinge. Arc shaped legs deploy form the riser when the lid is moved from a closed position to an deployed position a position where the lid rests against the opposite side of the base. The legs are formed by deforming a sheet of flexible material that lies between the base and a cover plate. The lid and the sheet of flexible material are coupled to each other so that when the lid is moved from the closed to the deployed position, the sheet of material is deployed.

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Owner:FELLOWES INC

Source driver, method for manufacturing same, and liquid crystal module

ActiveUS20100302474A1Advantageous in heat dissipation propertyCost reductionSemiconductor/solid-state device detailsPrinted circuit aspectsCopper foilSprocket

In at least one embodiment, a source driver of a film package type, includes: a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals each of which is connectable to an external member, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals, respectively, the input terminal region being provided on the surface of the film substrate; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals, respectively, the output terminal wiring region being provided on the surface of the film substrate; and sprocket portions at opposite ends of the film substrate, each of the sprocket portions having a copper foil on the surface, and a string of holes, the input terminal wiring region and the output terminal wiring region being provided so as to extend toward opposite ends having no sprocket portion, respectively, the source driver further including a heat conducting patterns for connecting the third terminals, each of which is connected to neither any one of the plurality of first wiring lines nor any one of the plurality of second wiring lines, to the copper foils of the sprocket portions, respectively, the heat conducting patterns being provided on the surface of the film substrate. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.