The invention belongs to the field of antennas of
electronic communication technology, and relates to a
package substrate distributed antenna. The antenna structure is distributed and designed on a
package and a substrate, low-loss
interconnection of electromagnetic signals from the
package to the substrate is realized through
coupling inside the antenna instead of conductor connection, and the package and the substrate are interconnected through
electromagnetic coupling. With application of the
radiation structure integrated on the substrate, electromagnetic
waves coupled by the package are radiated in a specific mode. The package substrate distributed antenna is multiplexed by changing the substrate, and the
multiplexing of the package substrate distributed antenna is realized by changing the
radiation structure on the substrate without changing the package. The internal
interconnection loss of the antenna is reduced, the limitation of the working
frequency band of a
chip package distributed antenna is solved, the realization of a
millimeter wave low-frequency-band distributed antenna becomes possible, more design freedom degrees and flexibility are brought to the design of the
millimeter wave antenna, the design period and cost of the
millimeter wave
integrated antenna are reduced, and the
multiplexing of the
package design is realized.