499results about How to "Improve contact reliability" patented technology

A small and thin lateral pushing type push switch of the one- or two-step operation type in which excellent operation properties of a dome-like metal plate serving as a movable contact can be obtained is provided. The push switch has a presser having: an inclined portion 9a which converts an operating force in the moving direction of a push button, to a force in the operation direction of a dome-like metal plate; a flexible hinge portion which allows the inclined portion to be moved in the operation direction of the dome-like metal plate; and a pressing portion which presses down the dome-like metal plate. The dome-like metal plate is disposed in two stages in the operation direction of the metal plate.

Provided are an organic light emitting display device and a manufacturing method thereof. In the organic light emitting display device, after an auxiliary electrode having a multilayer structure including different kinds of metals different in etching speed is formed, a void is formed within the auxiliary electrode upon formation of an anode. The resulting structure is created by a simplified process, with contact reliability between a cathode and the auxiliary electrode being enhanced, while resistance of the cathode is reduced.

In an ultrasound transducer arrangement comprising at least one piezoelectric body with a lower and an upper electrode and a coupling layer including a wafer on which the ultrasound transducers are disposed and are connected to the lower electrode, a conductor structure of uniform height is disposed on the wafer and is in contact with the lower electrode and any space between the piezoelectric body and the wafer is completely filled with a cement material.

A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

A connector includes a socket in which a plurality of first splices are provided in parallel in an opening edge portion and a plug which has a flat shape. The plug is capable of being fitted in the opening edge portion of the socket. The plug includes a plurality of second splices press-fitted in press-in grooves provided in parallel at positions corresponding to the first splices in the plug. Each of the first splices is fitted and abuts on an inside surface of one of the press-in grooves. Each of the first splices is brought into elastic contact wit one of the second splices to establish electrical connection.

A press-fit terminal includes a pair of the resilient contacts being swelled outward, and having a deformation space into which the resilient contacts are deformed. The press-fit terminal is electrically connected to a conductive inner wall of a through-hole on a circuit board by pressing the press-fit terminal into the through-hole. The press-fit terminal includes abutting portions on each inner wall of the pair of the resilient contacts. When the abutting portions abut on each other, the abutting portions regulate deformation of the resilient contacts in a narrowing direction to narrow the deformation space. Then inclined walls formed on the abutting portions induce the resilient contacts to slide on the inclined walls in a direction to separate the resilient contacts from each other.

A connector has a base having insertion holes in parallel at a predetermined pitch, A connector has a base having insertion holes in parallel at a predetermined pitch, H-shape connecting terminals laterally inserted into the insertion holes, each connecting terminal having a support contact piece on a lower side of the connecting terminal, a manipulation contact piece on an upper side of the connecting terminal, and a coupling portion which couples the support contact piece and the manipulation piece, and a manipulation lever rotatably attached to a bearing portion of the support contact piece disposed on a first side of the base. A latching pawl, formed on a first end of the support contact piece, is latched on an edge portion of the base. A flexible board is inserted from an opening on a second side of the base. The manipulation lever manipulates the manipulation contact piece to bring an end portion of the manipulation contact piece into pressure-contact with the flexible board.

A plug connector device (10) for multicore flat cables (15), has a plug (11) which can be fixedly joined to one end of a flat cable in a mechanical fashion, and a plug socket (12) which can be run through by the flat cable (15) such that, with their first contact ends (62), contact elements of the plug socket (12) engaging in the plug (11) can be electronically connected to the flat cable at their other contact ends (63) using IDC technology. To assure that the plug connector device is robust and has high contacting reliability, provision is made that plug (11) is provided with contact elements (18), whose first contact ends (38) are configured for the electrical connection to the first contact ends (62) of the contact elements (19) of the plug socket (12), and whose other contact ends (36) are configured for the connection to the flat cable (15) using IDC technology.

The invention concerns a test element analytical system for the analytical examination of a sample, especially a body fluid, comprising at least one test element with one or more measuring zones and contact areas located on the test element, in particular electrodes or conductor paths, the sample to be examined being brought into the measuring zone to carry out an analysis in order to determine a characteristic measured quantity for the analysis, and an evaluation instrument with a test element holder for positioning the test element in a measuring position and a measuring device for measuring the characteristic change, the test element holder containing contact elements with contact areas which enable an electrical contact between the contact areas of the test element and the contact areas of the test element holder, characterized in that one of these contact areas is provided with an electrically conductive hard material surface.

Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer.

A connector has a housing (1) with a cavity (2) for receiving a terminal fitting (3). The terminal fitting (3) has a tubular main portion (6) and a locking hole (12) is formed in the main portion (6) for receiving locking projection (5B) of a lock (5). A tongue (14) extends from the front end of the main portion (6) and is folded back into the main portion (6). The front end of the locking projection (5B) is located before an extending end (14C) of the tongue (14) and the rear end thereof is located behind the extending end (14C) of the tongue (14). Accordingly, the locking projection (5B) is long at a position where a front end surface (5C) of the locking projection (5B) receives a shear force from a front edge (12A) of the locking hole (12), thereby enlarging a sectional area against the shear force.

Provided is a hybrid integrated circuit module and a manufacturing method thereof. The manufacturing method comprises the steps that a substrate, a heat radiator and a glass fiber plate with through holes arranged at preset positions are manufactured, and an insulating layer is covered on one of the surfaces of the substrate; the glass fiber plate and the heat radiator are arranged on the surface of the insulating layer; a circuit wiring layer is arranged on the surface of the glass fiber plate; power elements and non-power elements are respectively distributed on the heat radiator and the corresponding positions of the circuit wiring layer; and metal wires are connected between the circuit wiring layer, the heat radiator, the power elements and the non-power elements. Contact reliability of bonding points is enhanced, length of bonding wires is reduced and height difference of the bonding wires is reduced so that wire punching rate in molding can be effectively reduced, and thus qualified rate of manufacturing and long-term reliability of an intelligent power module are enhanced.

A connection and junction box for a photovoltaic solar module having flexible flat conductor bands protruding from the surface of the solar module, wherein the connection and junction box has an insertion mouth at its side in mounting state facing the solar module, for at least one of the flexible flat conductor bands of the solar module, as well as comprising a housing for attaching to the solar module, and a connection device for the flexible flat conductor band, positioned in the housing, the connection device has a deflection arm and an electrical contact clamp, which is actuated when attaching the box to the solar module for bending and contacting the flat conductor band.