49results about How to "Guaranteed Electromagnetic Compatibility" patented technology

The invention discloses a dual-channel transmitting assembly for a phased array antenna of a carrier rocket relay user terminal, which includes a first channel radio frequency circuit and a second channel radio frequency circuit; the first channel radio frequency circuit includes: a sequentially connected second channel radio frequency circuit A digitally controlled phase shifter for one channel, a driving amplifier for the first channel, a power amplifier for the first channel, a microstrip directional coupler for the first channel, a single-section isolator for the first channel, and a first channel connected to the microstrip directional coupler for the first channel channel detection diode; the second channel radio frequency circuit includes: a second channel digitally controlled phase shifter, a second channel drive amplifier, a second channel power amplifier, a second channel microstrip directional coupler, a second channel A single-section isolator, and a second-channel detection diode connected to the second-channel microstrip directional coupler. Compared with the single-channel phase-shifting transmitting assembly, the present invention has a compact structure, which is beneficial to reducing the front area of ​​the phased array antenna and reducing the weight of the whole machine of the phased array antenna.

The invention relates to a multi-channel compound heat radiating sealing chassis which is characterized in that outer sealing plates are arranged on two sides of a chassis frame, an upper cover plate and a lower cover plate are arranged on and under the chassis frame, two ends of the chassis frame are provided with a front panel and a rear sealing plate, a fan is arranged on the rear sealing plate, a connector frame is arranged inside the chassis frame, a separation plate for separating a strong current region and a weak current region is arranged on the connector frame, a side wall heat radiating fin is arranged on the connector frame in the strong current region, an installing plate is arranged on one side of the weak current region, which is positioned on the rear sealing plate, an inner fan is arranged on the installing plate, an inner separation plate is arranged between the inner fan and the rear sealing plate, heat radiating fins are arranged on two ends of the inner separating plate; and two side surface heat exchange plates are arranged on two sides of the chassis frame and positioned between the chassis frame and the outer sealing plates. According to the invention, by adopting a method of combining conduction with secondary forced heat radiation, the problem of heat radiation of a high-density and large-power sealing electronic device can be effectively solved.

The invention relates to an intelligent type low-voltage in-set draw-out switch device and an anti-interference signal dynamic and static plugins thereof. The dynamic and static plugins are respectively provided with two or multiple signal dynamic or static plug-in pieces and one grounding dynamic and static plug-in piece; the dynamic and static plugins are respectively provided with an insulation shell and a metal shielding body and are respectively in contact with the metal shielding body through a grounding connection post through each grounding plug-in piece of the dynamic and static plugins, and the grounding continuity of signal dynamic and static plugin bodies can be realized; signal dynamic plugins are arranged on a drawer unit, signal static plugins are arranged on a cabinet body, and connection, test and disconnection are realized through a drawer pushing and interlocking mechanism. According to the intelligent type low-voltage in-set draw-out switch device disclosed by the invention, the anti-interference capacity of signal transmission of the signal dynamic and static plugins in connection application is greatly increased, quick connection is realized, the operability and the electromagnetic compatibility of the intelligent type low-voltage in-set draw-out switch device and the reliability of an anti-interference signal transmission application function are increased.

The invention discloses a dust-proof device, which comprises a chassis panel, on which a heat dissipation hole of the chassis is arranged for heat dissipation of the chassis; The overturning of the overturning component seals or opens the opening of the heat dissipation hole; and the dustproof part is arranged in the overturning component. The beneficial effects of the present invention are as follows: one is to adopt the structure that a rotary spring is arranged between the rotating shaft and the dust-proof mesh, which is convenient for opening and closing, and is convenient for maintenance. It is made of metal, which can ensure the electromagnetic compatibility performance of the chassis; the third is to properly set up cooling holes, which can not only ensure the heat dissipation requirements, but also ensure the electromagnetic shielding performance of the chassis.

The invention discloses a front-end digitallizer based on an FPGA. The front-end digitallizer comprises a digital front end and an analytical back end, wherein the digital front end is connected to the analytical back end; the digital front end is used for collection, pre-processing, storage and transmission of a spatial electromagnetic signal, packaging an original spatial electromagnetic signal and feature value data into a data frame and transmitting the data frame to the analytical back end; and the analytical back end is used for receiving and analyzing the data frame sent by the digital front end, carrying out data post-processing on the data frame and providing interface management. The device has strong electromagnetic compatibility, and measurement capability of characteristic parameters of the spatial electromagnetic signal of heavy sensitive equipment can be improved.

The invention discloses an electromagnetic compatibility shielding chamber of a KVM all-in-one machine, and specifically relates to the technical field of testing. The electromagnetic compatibility shielding chamber of the KVM all-in-one machine includes a cavity surrounded by an upper cover and a lower cover. The side walls of the upper cover and the lower cover are connected by connecting bars. The outer surface of the connection between the connecting strip and the upper cover and the lower cover is coated with copper foil. foil, and a conductive cloth pad is also pasted on the side wall of the head end of the cavity.

The invention relates to a filtering assembly, which comprises a filtering circuit board, a casing with a chamber, and a cover plate. A shielding plate is arranged in the chamber of the casing, and the shielding plate divides the chamber into left and right chambers. The filtering circuit board Fixed in the left chamber, the filter circuit board is installed with a filter circuit, the right chamber is equipped with a power conversion component, the input end of the filter circuit board is welded with an input lead, the output end of the filter circuit board is connected to the input end of the power conversion component, and the power supply Output leads are welded at the output end of the transformation component, and insulators are respectively arranged on the left and right side walls of the housing, and the insulators are fixed on the side walls of the housing, and the input and output leads pass through the insulators. The invention has the advantages of good shielding effect, high integration, small volume and strong anti-electromagnetic interference ability, improves the stability of the output voltage of the power conversion part, and ensures that the electromagnetic compatibility of the power conversion part meets the requirements of GJB.

The invention discloses a contactless online testing device for an input impedance at each position of a printed circuit board. The device comprises a mechanical scanning holder, a mechanical controlmodule, a microminiature near field signal sensor, a signal obtaining module, a signal analysis module, a display module, a storage module and a power module. Through utilization of the microminiaturenear field signal sensor and the signal obtaining module, near field magnetic field signals around input or output signal lines of a chip, a component and a circuit module at each position of a tested printed circuit board are coupled and obtained. Through utilization of the signal analysis module, the signals are processed, and the input impedances of the chip, the component and the circuit module at each position of the tested printed circuit board are solved, and corresponding amplitude frequency and phase frequency information is output. According to the device, through adoption of the contactless microminiature near field signal sensor, influence on a working state of the printed circuit board is low. The device is applicable to online testing of the input impedances of the chip, thecomponent and the circuit module at each position of the printed circuit board.

The invention relates to a prediction analysis system and method for EMC (Electro Magnetic Compatibility) in a system. The prediction analysis system comprises two main parts, namely a first part and a second part, wherein the first part is an input and initialization part and mainly completes input of predictive parameters, generation of spectrum data and files in the system and establishment of cable topological graphs; the second part is a prediction task analysis module and is mainly combined with a series of data files generated by an input and initialization module to complete generation of an EMC index and EMI(Electro Magnetic Interference)evaluation and analysis functions. The prediction analysis system for EMC breaks the technological monopoly, and the invention provides the new system and method to enable the EMC analysis of equipment to be more convenient. The prediction analysis method for EMC ensures EMC as much as possible in the whole research cycle and even the whole life cycle of the system. The EMI evaluation and trade-off analysis of the system are realized in the research cycle of the system, an economic and effective technological means is provided in the overall life cycle of the system, and the EMC of the system is most likely realized.