71results about How to "Few connections" patented technology

Described are methods and systems for managing the connections between a client, an intermediary appliance and a server, so that asynchronous messages can be transmitted over HTTP from the server to a client. When a connection is established between a client and an intermediary, and the intermediary and a server to establish a logical client-server connection, that logical client-server connection is labeled and not maintained, while the connection between the client and the intermediary is maintained. Messages generated by the server and destined for the client are transmitted to the intermediary along with the connection label. The intermediary can then use the connection label to determine which client should receive the message.

A method of device maintenance, comprising: providing a maintenance network including a user site and a multi-device servicing site that provides maintenance to at least one target device in said user site; selecting, by a user, a degree of access of maintenance functions of said servicing site to at least one of maintenance-related information of said target device and commanding said target device to perform a maintenance-related task; and setting said degree of access.

Described are methods and systems for managing the connections between a client, an intermediary appliance and a server, so that asynchronous messages can be transmitted over HTTP from the server to a client. When a connection is established between a client and an intermediary, and the intermediary and a server to establish a logical client-server connection, that logical client-server connection is labeled and not maintained, while the connection between the client and the intermediary is maintained. Messages generated by the server and destined for the client are transmitted to the intermediary along with the connection label. The intermediary can then use the connection label to determine which client should receive the message.

The present invention relates to a serial-to-Ethernet modular converter jack and a method of fabricating of the same. The serial-to-Ethernet converter electronic components, including the control software stored in on-board memory, are miniaturized and housed entirely in an RJ-45 jack. The present invention is constructed of a shielded housing that defines an open front portion for a connector port. The housing of the present invention also includes a segregated interior chamber, which encases all of the electrical components necessary to complete a serial-to-Ethernet conversion of data. Lead pins electrically connected to the circuitry within the interior chamber, protrude from the based of the connector jack providing for a means to mate the jack to a circuit board. First, second and third circuit boards collectively incorporate the serial-to-Ethernet circuitry components. Both the first circuit board incorporating magnetic circuitry and the second circuit board incorporating control circuitry are positioned in generally horizontal parallel relation within the interior chamber. The second circuit board which defines opposed sides includes electronic components disposed upon the upper and lower of both sides of the second circuit board. The third circuit board, incorporating connections to the LEDs, is positioned generally perpendicular in relation to the first and second circuit boards and is structurally connected to the first and second circuit boards, additionally providing an electrical connection between the first and second boards. Alternative embodiments of the invention are disclosed and include various arrangement of the serial-to-Ethernet circuitry within the interior chamber of the housing.

Proximity sensor, particularly for usage in an electronic mobile device, comprising at least one acoustic transducer adapted for receiving acoustic signals at least in parts of the frequency range of human audible sound and emitting and / or receiving ultrasonic signals for proximity estimation. The acoustic transducer preferably is a Micro-Electro-Mechanical-Systems (MEMS) microphone. Further, a method in an electronic device comprising an acoustic transducer is provided comprising the steps of generating at least one electric signal in the frequency range of ultrasonic sound, emitting at least one ultrasonic signal by means of the acoustic transducer; receiving at least one ultrasonic signal by means of the acoustic transducer; deducing from the at least one emitted ultrasonic signal and the at least one received ultrasonic signal at least the delay between emission of the emitted ultrasonic signal and reception of the corresponding ultrasonic signal.

A method, apparatus and computer program product are provided for facilitating device discovery so as to consume less power with reduced channel occupancy. In regards to a method implemented by a master device, a scan for an advertisement is caused to be performed and an advertisement packet is received during the scan that defines a time period in which the source device of the advertisement packet will be performing a page scan. The method also determines the time period in which the source device of the advertisement packet will be performing the page scan. The method also causes a page to be issued during the time period in which the source device of the advertisement packet will be performing the page scan, and then receives a page response in response to the page. Corresponding apparatus and computer program products as employed by both master and slave devices are also provided.

The invention describes a method of manufacturing a VCSEL module (100) comprising at least one VCSEL chip (33) with an upper side (U) and a lower side (L) and with a plurality of VCSEL units (55) on a common carrier structure (35), the VCSEL units (55) comprising a first doped layer (50) of a first type facing towards the lower side (L) and a second doped layer (23) of a second type facing towards the upper side (U). The method comprises the steps of dividing the VCSEL chip (33) into a plurality of subarrays (39a, 39b, 39c, 39d, 39e, 39f, 39g, 39h, 39i) with at least one VCSEL unit (55) each, electrically connecting at least some of the subarrays (39a, 39b, 39c, 39d, 39e, 39f, 39g, 39h, 39i) in series. The invention also describes a VCSEL module (100) manufactured in such process.

A milking system may include a milking stall (1, 51), which an animal may visit to be milked automatically. The milking stall including an animal identifier (9, 53); a gate controller (7, 55) for opening an entry and exit gates (3, 5); a milking machine (11, 57), wherein the teat cups, during milking of a milking animal in the milking stall, are applied to the teats of the milking animal and are connected to vacuum (19, 63) such that milk can be drawn from the milking animal and be collected in the vessel; and a robot (13, 65) provided with a robot arm (21) and a gripper (23) for automatic application of the teat cups to the teats of the animal. The milking system may also include a master computer (75) adapted to hold a database (77) of milking animals capable of visiting the milking stall, to receive an identification of a milking animal from the animal identifier, and adapted to control the gate controller, the milking machine, and the robot depending on the received identification. The robot may include a slave processor (81), connected to receive information from the master computer, according to which movement of the robot arm of the robot is to be performed, and adapted to control the robot to move the robot arm of the robot according to the received information.

A method of forming integrated circuit (IC) die configured for attachment to another die or a package substrate, and stacked IC devices therefrom. At least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) including a tip protruding beyond the bottom surface to a tip length is provided. The tip has an outer dielectric tip liner, and an electrically conductive portion within the outer dielectric tip liner. A compliant layer is applied to the bottom surface of the IC die. The dielectric tip liner is removed from a distal portion of the tip to expose an electrically conductive tip portion. A solder material is deposited on the exposed distal portion of the tip. The solder material is reflowed and coalesced to form a solder bump on the distal portion of the tip.

One or more magnets are mounted on the rotor of a motor / actuator and analog Hall Effect sensors are mounted on the stator of the motor actuator to provide the necessary feedback for both speed and position control of the rotor. The feedback system includes signal conditioning circuitry for conditioning the sinusoidal signal produced by the magnet and the Hall Effect sensors and a tracking converter observer algorithm executing on the system microprocessor to produce controlled motion. The controller (and other electronics) may be integrated into the housing of the motor or actuator to provide a compact, efficient system for use in a number of applications.

A liquid crystal display module and an integrated driving board thereof are disclosed. The driving board includes a substrate, a circuit pattern, a timing clock driver, a light emitting diode (LED) driving module, a color management module and a photosensitive chip. The circuit pattern is disposed on the surface of the substrate. The timing clock driver, the LED driving module, the color management module and the photosensitive chip are disposed on the substrate and electrically coupled to the circuit pattern. The LED driving module is electrically coupled to the timing clock driver. The color management module is electrically coupled to the LED driving module. The photosensitive chip is electrically coupled to the color management module.

A damage sensor comprises a probe track, a sense track, and a signal generator operable to input a probe signal to the probe track. The probe track and the sense track are electromagnetically coupled by a structure on which they are provided, such that the probe signal induces, in dependence on the degree of electromagnetic coupling between the probe track and the sense track, a sensed signal in the sense track. The magnitude, phase and frequency of the sensed signal can be analysed in order to determine whether and where damage has occurred to the structure.

A near-boiler piping loop apparatus is provided including a primary / secondary piping loop interface apparatus having a unitary construction including a secondary loop shut-off valve, drain valve and drain port in each branch of a secondary loop for connection to a boiler. Supply branch piping and return branch piping connects the interface apparatus to the boiler and provides attachment points for auxiliary plumbing equipment. The apparatus is adapted to connect to pump in variable orientations using rotatable flanges on the interface apparatus and on a wye strainer in the secondary loop supply branch and includes a union fitting attached to the interface apparatus. The union fitting provides a mounting hole for a temperature or pressure gauge.

An immersion pump assembly includes an electric drive motor and a control device (14) for controlling the drive motor, which are configured for dipping into a liquid (18) to be conveyed. An external display device (26) and / or an external communications device are / is configured for arrangement outside the liquid (18) to be conveyed and are / is connected to the control device (14) for signal transmission.

A purge valve comprising a valve body having a first primary loop port, a second primary loop port, a first secondary loop port and a second secondary loop port is provided. The secondary loop ports are disposed at respective ends or a linear secondary loop portion of the valve body. A primary loop portion of the valve body is formed by a pair of closely spaced tees extending from the secondary loop portion. At least one main valve portion is disposed in a first one of the tees. A drain / venting valve portion extends from the main valve portion. A portion of the secondary loop portion between the tees is shared with the primary loop portion in which flow in a primary loop and a secondary loop are hydraulically separated. A second drain / venting valve portion may be provided in a second one of the tees.