The invention discloses a sealing method for
laser filler
welding of
hybrid integrated circuit package. The sealing method comprises the following steps: 1, an aluminum
alloy casing and an aluminum cover plate are rinsed by using
acetone; 2, joints are assembled, a stepped groove is arranged in the aluminum
alloy casing, the aluminum
alloy cover plate is mounted on the aluminum alloy casing, the aluminum alloy casing and the aluminum alloy cover plate are butted by utilizing a tool, the butting mode is corner joint, and a joint gap is formed at the joints; 3, pre-filler is filled in the joint gap; 4,
spot welding is carried out, a Nd:YAG (nipigin-doped:
yttrium aluminum garnet)
laser is adopted, the relative positions of the aluminum alloy casing, the aluminum alloy cover plate and the pre-filler are fixed, and the
spot welding is proceeded in protective gas; 5, the overall
welding is carried out, the Nd:YAG
laser is adopted, a mouth-shaped
welding form is adopted, and the
welding process is proceeded in the protective gas. With the adoption of the sealing method, the welding reliability is good, the air-tight seal is good, and the welding seam is attractive and crack-free.