Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

71 results about "Minimal contact" patented technology

Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of IC during pressing

A method of forming an electronic assembly including a plurality of IC die having bonding terminals that have a solderable material thereon and a workpiece. The workpiece includes workpiece contact pads including an elevated ring having a ring height at least 5 μm above a minimum contact pad height in an indented bonding region that is within the elevated ring. The bonding terminals and / or the plurality of workpiece contact pads include solder thereon. A plurality of IC die are mounted on the workpiece. Heat is applied so that the solder becomes tacky while remaining below its melting temperature to obtain a tacked position. The plurality of IC die are pressed using a pressing tool to heat the solder to a peak temperature that is above the melting temperature. The elevated ring resists horizontal movement of the plurality of IC die from their tacked positions during pressing.
Owner:TEXAS INSTR INC

Gas cooled minimal contact area(MCA) electrostatic chuck(ESC) for aluminum nitride(ALN) pvd process

Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.
Owner:APPLIED MATERIALS INC

Current limit engagement apparatus

An electrical connector is constructed with at least one pin configured to provide different resistance values as the pin is engaged with a socket. When the connector is fully engaged with the socket the resistance of the connector is at a zero or minimal value. When the pin first contacts the socket, the pin includes a high series resistance minimizing the sudden inrush of current to an electrical device, and minimizing any arcing between the pin and the socket. As the pin engages the socket this series resistance decreases allowing the electronic device to utilize its full designed current with only minimal contact resistance between the pin and the socket.
Owner:HEWLETT PACKARD DEV CO LP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products