The invention belongs to the technical field of production of electronic products, and specifically relates to an
electronic component manufacturing method. An injection mold is adopted to perform plastic
package, and the injection mold includes a rack, a mold, a drainage mechanism and an air control mechanism. The steps of plastic
package include A, prearranging gas; B, feeding; C, injection; D,cooling molding; and E, demolding. In Step A, a
piston rod is pulled downward, so that gas enters into a cylinder; in Step B, chips are put at the bottom of a fixed groove, the
piston rod is continuedto be pulled downward, and the chips are fixed; in Step C, molten plastic
package resin is injected into the fixed groove from a drainage rod, and at the same time, the
piston rod is continued to bepulled downward; in Step D, the
piston rod is fixed, the mold is cooled, and the plastic package resin is molded; and in Step E, the
piston rod and sliding racks move upward, and demolding is performed. By adoption of the scheme, rein can be effectively prevented from flowing to the bottoms of the chips in the
injection molding process, the risk of a
chip lead
short circuit is reduced, and the product yield is improved.