Electronic component manufacturing method
A technology of electronic components and manufacturing methods, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of resin overflowing to the bottom of the chip, easy impact leads, chip scrapping, etc., to prevent clogging and sealing Good performance, good injection molding effect
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Embodiment 1
[0027] Basic as attached figure 1 Shown:
[0028] The manufacturing method of the electronic components adopts an injection mold for plastic sealing, and the injection mold includes a frame 1, a mould, a drainage mechanism and an air control mechanism.
[0029] The overall mold is in the shape of a cylinder, including a fixing groove 2 and a cover plate 3 . The top of the fixing groove 2 is open, and an annular groove is provided on the side wall of the top of the fixing groove 2; Port 21; the outer circumference of the fixing groove 2 is provided with an annular cooling groove 22 for cooling the mould. The cover plate 3 is used to cover the top of the fixing groove 2 , and the cover plate 3 is slidably connected in the groove on the top of the fixing groove 2 ; the center of the cover plate 3 is provided with a raised injection port 30 . An injection molding cavity 4 is formed between the fixing groove 2 and the cover plate 3 . In order to give the cover plate 3 enough sl...
Embodiment 2
[0039] The difference between this embodiment and Embodiment 1 is: when the gas is preset in step A, the piston rod is pulled down until the distance between the piston rod and the top of the cylinder is equal to one-eighth of the height of the cylinder; Cool and form.
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