34results about How to "Increase land area" patented technology

The invention relates to the field of agricultural cultivation, and discloses a rice tiller retaining and ear increasing high-yield fertilizer applying technology. The fertilizer applying technology includes the steps that according to the total fertilize applying amount of nitrogen fertilizer of 140-185 kilograms / hectare metered according to pure nitrogen, phosphatic fertilizer of 60-90 kilograms / hectare metered according to P2O5 and potash fertilizer of 70-120 kilograms / hectare metered according to K2O, and the fertilizer is applied in four fertilizer applying stages; base fertilizer is applied before plowing or harrowing; striking root fertilizer is applied 3-10 days after rice transplanting; tillering fertilizer is applied 43-55 days before rice earing; tiller retaining and ear increasing fertilizer is applied 35-45 days before rice earing; later earing fertilizer is not applied. A traditional fertilizer applying method of applying earing fertilizer originally is changed, earing fertilizer is not applied any more, a brand-new fertilizer applying stage namely the stage of applying the tiller retaining and ear increasing fertilizer is added in the 10-15 day rice growth stage before applying the earing fertilizer originally, fertilizer application ratio of other fertilizer application stages is adjusted, a normalized and standardized fertilizer application concept is provided, and high and stable yield of rice is achieved.

The utility model relates to a high-level floating water channel system, which relates to a water slideway. An elevated floating water channel system for sports or recreation is provided. Equipped with a water diversion tank device, a small boat, at least one set of water pump spray device and a water platform device; The water pump spray device is provided with a water storage tank, a water pump, a pipeline, a nozzle or a water outlet, the water storage tank is connected to the water channel, the water pump is connected to the water storage tank, and the water pump is connected to the water spray port or the water outlet on the water diversion tank through the pipeline; a water pump The water spray device is provided with at least one nozzle or water outlet; the water platform device is arranged on the water surface for fixing the upright column supporting the water diversion tank, and the water platform device is provided with a floating body, a platform, a pile and a lifting power mechanism.

The present invention relates to a method for optimizing the topography and the geomorphology of a dump in a large opencast coal mine in the loess area. The method comprises: "soft base removal", "base gully filling", "smooth base blasting treatment", "base piling for skid resistance", "fan-shaped disposal and layered compaction", and other steps. According to the method provided by the present invention, based on the simulation of the original "plateau" geomorphology millions years ago in the loess plateau, the artificial landmine terraces mode of the traditional sloping land in the water and soil erosion area in the Loess Plateau are changed; and relying on the convenient conditions of the mining and moving soil, the large-scale earthwork is used to deploy and form the basin geomorphology to co-ordinate the hydrological topography, and micro-topography modification is used to reduce the generation of the surface runoff, so that under the premise of ensuring the stability of the dump, the geomorphology of the dump in the large opencast coal mine in the loess area is restored to the "plateau" geomorphology, and the foundation is provided for the restoration of ecosystems and biological diversity.

The invention discloses a wharf structure suitable for a silt coast. A direction which is close to the sea is used as a front direction, and a direction which is relatively away from the sea is used as a rear direction. The wharf structure comprises a causeway, a front diaphragm wall, a rear diaphragm wall, a partition, a plurality of coupling beams and a wharf upper part structure, wherein the front diaphragm wall, the rear diaphragm wall and the partition form a cylindrical caisson structure; the coupling beams are connected with the rear diaphragm wall and a pile foundation; and the wharf upper part structure covers the front diaphragm wall, the rear diaphragm wall, the partition and the pile foundation. By the structure, construction difficulty and engineering investment costs are reduced effectively. A construction method comprises the following steps: (1) constructing the causeway by bagged sand quilts; (2) reinforcing the causeway and silt filled at the rear of the causeway in a blowing manner, reinforcing new silt filled in the blowing manner, and constructing the front diaphragm wall, the rear diaphragm wall and the partition to form the cylindrical caisson structure when the bearing capacity of foundation soil reaches 5 tons at least; (3) excavating causeway remaining earthwork in front of the front diaphragm wall and earthwork under a natural silt surface, and enabling the front edge of a wharf to reach designed water depth; and (4) constructing the pile foundation and the coupling beams, and then constructing the wharf upper part structure. The construction method is simple.

A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.