34results about How to "Heat dissipating structure" patented technology

A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a plurality of heat sinks are provided, wherein a plurality of through holes are formed around each of the heat sinks. First chips, the heat sink module plate, and second chips are successively stacked on the chip carrier module plate, wherein the second chips are electrically connected to the chip carrier module plate by conductive wires penetrating the through holes of the heat sink module plate. After a molding process is completed, a singulation process can be performed to separate the chip carriers and the heat sinks, and thus individual semiconductor packages for integrating the heat sinks with the stacked chips are fabricated.

A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.

An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element. Accordingly, with the assembled electromagnetic shielding case, not only is the electronic component insusceptible to electromagnetic interference and easy to change, but it is feasible to provide highly efficient heat dissipation and a miniaturized heat dissipation structure.

A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.

A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a plurality of heat sinks are provided, wherein a plurality of through holes are formed around each of the heat sinks. First chips, the heat sink module plate, and second chips are successively stacked on the chip carrier module plate, wherein the second chips are electrically connected to the chip carrier module plate by conductive wires penetrating the through holes of the heat sink module plate. After a molding process is completed, a singulation process can be performed to separate the chip carriers and the heat sinks, and thus individual semiconductor packages for integrating the heat sinks with the stacked chips are fabricated.

A protective case with multiple air tunnels for the protective case, so the heat absorbed by contact blocks from the electronic equipment is radiated rapidly out of the protective case through vent pipes. When the electronic equipment is supported up to watch movie or play games, because the hot air will raise and be exhausted from the upper part, and the fresh cool air will come inside from lower part of the protective case, as a result, the ventilation is accelerated and the heat dissipation performance is greatly improved.

A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.

A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat, wherein chip-pressing parts (5) are provided to a cover member (4), so that IC chips (3) are pressed against heat dissipation sheets (1) by the chip-pressing parts (5), and each chip-pressing part (5) is configured from an elastic pressing part equipped with an elastically deformable elastic section (51), and a contact section (52) that comes into contact with a heat dissipation sheet (1), in order to provide an electronic device heat dissipation structure that exhibits sufficient heat dissipation properties and improves the reliability of the electronic device, and has a structure such that it is possible to reliably interpose a heat dissipation sheet between an IC chip and a cover member.

A heat dissipating structure is capable of dissipating heat quickly in a high power LED projector lamp to improve the heat dissipating efficiency. The structure includes a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate provides a plurality of grooves for mounting one end of the plate type heat pipe, wherein those two are perpendicular to each other. Furthermore, the heat dissipating fins having a plurality of slots are stacked and arranged at intervals for disposing the plate type heat pipe with an inclined angle. Hence, the heat generated from the high power LED will be conducted quickly and the heat dissipating efficiency will be improved.

A heat-dissipating structure for a flat panel display comprises a heat-collector plate, a soft thermal-pad and at least one heat-sink component. The heat-collector plate is made of metal material having a first-face, a second-face and a plurality of edge-sides. The first-face is contact with a back-bezel of the flat panel display. The soft thermal-pad is made of soft material with high thermal conductivity. The soft thermal-pad has a bottom-face and a top-face. The bottom-face is contact with the second-face. The top-face is contact with a heat-sink structure of an electric unit of the flat panel display. The heat-sink component is connected with at least one of the edge-side of the heat-collector plate. The heat-sink component is capable of conducting heat and expanding heat sink area.

A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.

A display module with heat dissipation structure and a handheld device thereof. The display module includes a touch panel, a display panel and a vapor chamber. One face of the display panel is correspondingly attached to the touch panel, while the other face of the display panel is correspondingly attached to the vapor chamber. The vapor chamber serves to support the touch panel and the display panel. Moreover, the vapor chamber serves to absorb the heat generated by the electronic component and quickly and uniformly spread the heat to dissipate the heat to achieve a heat spreading effect.

A light-emitting diode (LED) filament with a heat-dissipating structure includes multiple LED chips, multiple conductive carriers and a package layer. Each conductive carrier takes the form of a metal sheet and the multiple conductive carriers are spaced apart from each other. Each LED chip is commonly carried by and is electrically connected to two of the multiple conductive carriers adjacent to the LED chip. The package layer covers the multiple LED chips and the multiple conductive carriers with two lateral edge portions of each conductive carrier exposed from the package layer. The LED filament is mounted inside a light bulb. Because the multiple conductive carriers are partially exposed from the package layer, heat generated by the multiple LED chips can be dissipated to an ambient environment without affecting lighting efficiency and light output as a result of accumulated heat.

A heat dissipating structure for a computer casing includes a computer casing having a front board, a back board, and a bottom board, wherein the front board and the back board are parallel and correspond to each other by being connected together on the bottom board. There are two supporting frames mounted at an opposite side corresponding to the bottom board for respectively connecting with the upper sides of the front board and the back board so as to form a rectangular hexahedron. There are plural placing slots mounted on the front board for placing a disk drive, a CD-ROM drive, and plural connectors therein, wherein the front board further has the plural heat dissipating openings mounted thereon between the positions of the placing slots. Through the heat dissipating openings, the air flowing outside is drawn into the inside computer casing so that the heat generated by the electrical elements can be exhausted to the outside and a better heat dissipating effectiveness is achieved.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

The disclosed subject matter can include a vehicle lamp having a favorable light distribution and an effective heat dissipation structure. The vehicle lamp can include a light source and a casing in which the light source is sealed. The casing can be configured in a tubular shape and a reflector can be configured in a hollow of the casing. The casing can be sealed between the reflector and a front lens configured to allow light emitted from the light source to pass therethrough. The inner surfaces of the casing and the reflector can be configured to form a predetermined light distribution via the front lens. The outer surfaces of the casing and the reflector can be exposed to the outside and can be configured to radiate heat generated from the light source to the outside using heat conductive material. Thus, the lamp can be miniaturized and provide favorable light distribution.

The disclosed subject matter can include a vehicle lamp having a favorable light distribution and an effective heat dissipation structure. The vehicle lamp can include a light source and a casing in which the light source is sealed. The casing can be configured in a tubular shape and a reflector can be configured in a hollow of the casing. The casing can be sealed between the reflector and a front lens configured to allow light emitted from the light source to pass therethrough. The inner surfaces of the casing and the reflector can be configured to form a predetermined light distribution via the front lens. The outer surfaces of the casing and the reflector can be exposed to the outside and can be configured to radiate heat generated from the light source to the outside using heat conductive material. Thus, the lamp can be miniaturized and provide favorable light distribution.

A monitor supporting device for vehicle includes a control panel having a chamber formed by an inner peripheral surface, for receiving a housing and for detachably attaching the housing to the control panel with catches and protrusions. The housing includes a front recess formed by a partition for receiving an electronic device, and includes a rear space located behind the partition, and includes one or more orifices formed in the partition and communicating with the rear space of the housing, for forming an air passage and for air circulating and heat dissipating purpose, and for preventing the electronic device from over-heating, and thus for allowing the working life of the electronic device to be increased.

The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation.

A flashlight assembly includes a head portion having a receiving space, a light assembly received in the receiving space, and a radiator. The radiator is received in the receiving space and abuts against the light assembly. The radiator has an inner surface and an outer surface both defined therein. The inner surface has a protrusion extended therefrom. The protrusion abuts against the light assembly. Heat generated by the light assembly is conducted to the radiator via the protrusion and dissipated from the outer surface.

A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.

Provided are a heat dissipation structure for a display panel, and a manufacturing method and an application thereof. The heat dissipation structure includes a copper foil layer and a heat conducting layer disposed on the copper foil layer; wherein a material of the heat conducting layer includes a heat conducting material having a three-dimensional structure, and a gap in the three-dimensional structure of the heat conducting material is filled with a buffer.

A solid-filled encapsulated LED bulb with a base, at least one LED light source and at least one power supply element includes a transparent solid-filled heat-dissipating light guide member attached and covered onto the LED light source and the power supply element. A side of the heat-dissipating light guide member is packaged with the base to form the LED bulb. The heat of the LED light source is conducted and dissipated to the outside through the heat-dissipating light guide member. A light of the LED light source is outputted with an intensity IA through the heat-dissipating light guide member. The intensity IA of the light and the intensity IB of the LED light source satisfy the condition of (IA / IB)>70%. The use of a conventional dissipating structure is skipped to reduce the production cost and expedite the assembling and packaging processes while maintaining excellent heat dissipation and light output effects.

A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.