Light emitting module

Abstract

A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 103212473, filed on Jul. 14, 2014. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a light emitting module, and particularly relates to a light emitting module having a good heat dissipation effect and capable of reducing a risk of circuit break.[0004]2. Description of Related Art[0005]Generally, when a light emitting diode (LED) emits a light with a high luminance, a large amount of heat is produced. If the heat cannot escape and is accumulated in the LED, a temperature of the LED is continuously increased. In this case, the luminance of the LED is probably decreased due to overheat and a service life of the LED is decreased, or even the LED is permanently damaged. Therefore, a current li...

AI Technical Summary

Benefits of technology

The invention is a light emitting module that has a larger heat dissipation area and efficient heat dissipation. It uses a patterned conductive layer to connect the light emitting devices, which increases the contact area and facilitates heat transfer. This prevents circuit breakage and simplifies the process of combining the light emitting device package structure with the heat dissipation structure, reducing production costs.

Problems solved by technology

Generally, when a light emitting diode (LED) emits a light with a high luminance, a large amount of heat is produced.

In this case, the luminance of the LED is probably decreased due to overheat and a service life of the LED is decreased, or even the LED is permanently damaged.

However, after the circuit layout on the circuit board is completed, the serial-parallel connections of the LEDs cannot be easily modified, which is lack of flexibility in application.

Moreover, since the circuit board is generally configured with an insulation layer to achieve an insulation effect between different circuit layers, as the insulation layer is a poor conductor of heat, a rate that the heat of the LEDs is conducted to the heat sink through the circuit board is adversely influenced, which decreases heat dissipation efficiency of the LED light source module.

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