71results about How to "Excellent stress relaxation resistance" patented technology

This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420} / I0{420}>1.0, (1) where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

The invention discloses a copper alloy with an outstanding comprehensive performance. The copper alloy comprises the following components in percentage by weight: 0.4-2.0% of Ni, 0.2-2.5% of Sn, 0.02-0.25% of P, 0.001-0.5% of Si, and the balance Cu and inevitable impurities. The yield strength of the copper alloy is not less than 550MPa; the conductivity of the copper alloy is not less than 38% IACS; the bending processing performance meets that the R / t in GW direction is not greater than 1, and the R / t in BW direction is not greater than 2; the stress residue rate is not less than 75% after the copper alloy is subjected to temperature maintaining for 1000h under the temperature of 150 DEG C, so that the stress release resistance is outstanding. The alloy can be processed into slab strips,bars, wires, etc. based on different application demands; and the alloy can be widely applied to connectors such as electrical apparatus, automobile and communication apparatus, or terminals or switch parts.

Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower.

The invention relates to a copper alloy and application thereof. The copper alloy comprises 5-15 wt% of Zn, 0.2-2.5 wt% of Sn, 0.1-2.0 wt% of Ni, 0.01-0.3 wt% of P, 0-0.3 wt% of Mg, 0-0.5 wt% of Fe, and the balance Cu and inevitable impurities. Preferably, Ni, Sn and P meet that the sum of Ni and Sn is larger than or equal to 1.0 wt% and smaller than or equal to 3.5 wt%, the weight ratio of Ni toSn is 0.08-10, the weight ratio of Ni to P is 2-15, and Ni and P form a NiP compound in a base body. In crystal orientation analysis measured by EBSD, the Brass orientation deviation angles (011)(211)are smaller than 15 degrees, and the area proportion is 10-25%. Meanwhile, the yield strength is larger than or equal to over 600 MPa, the electric conductivity is larger than or equal to 25% IACS, the bending machining performance is excellent, namely, a value R / t in the GW direction is smaller than or equal to 1, and a value R / t in the BW direction is smaller than or equal to 2. The copper alloy is applicable to connectors such as electric parts, car parts and communication devices, terminals and switch parts.

This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.