39results about How to "Avoid wiring difficulties" patented technology

The invention discloses an embedded intelligent monitoring and remote maintenance system of a powder forming machine. The embedded intelligent monitoring and remote maintenance system is composed of an on-site monitoring unit and a powder forming machine manufacturer remote maintenance center. A workshop on-site monitoring platform has the function of obtaining the important running state of the powder forming machine through real-time data interaction with a main controller of the powder forming machine and through workshop field data collected through data collection devices such as a sensor, a video collection device and an audio collection device, the function of displaying the real-time running state of the powder forming machine on a display device, the function of alarm prompt and the like. Meanwhile, the on-site monitoring unit can conduct data compression and data classification on state parameters of the powder forming machine and sends data to a remote maintenance center of a device producer and a person in charge of a certain part of the powder forming machine through an Ethernet interface, a GPRS interface and a short message sending module, and therefore online monitoring and remote fault diagnosis of the powder forming machine, and the maintenance service are achieved, and related personnel are notified. The embedded intelligent monitoring and remote maintenance system is low in cost, complete in function, high in configurability and high in tailing capability, functional modules can be increased or reduced according to the on-site running state of the powder forming machine, and the embedded intelligent monitoring and remote maintenance system has high universality.

The invention discloses a fan filter unit. The fan filter unit comprises a fan filter unit body. At least one side edge of the four side edges of the fan filter unit body is provided with lamps, and the power lines of the lamps are integrally arranged with a power line of the fan filter unit. The lamps are integrated with the fan filter unit to form a mechanism similar to a module, and thus circuits on the upper portion of a ceiling are greatly reduced, and the wiring difficulty is lowered.

The invention provides a refrigeration plant and its placing method, and belongs to the technical field of the refrigeration plant. A refrigeration plant comprises a power supply track paved in a stacking zone; the power supply track comprises two electrified lead rails spaced in parallel; lead rail contact points or tray cars are arranged on the lead rails; meanwhile, the lead rails are stacked with refrigeration plants of a refrigeration case with a contact foot and a contact point. The contact foot at the bottom part of the refrigeration case is directly contacted with the lead rail contactpoint on the electrified lead rails or with the tray cars with conductive wheels; the contact foot of the refrigeration case at the upper layer is contacted with the case contact point at the top part of the refrigeration case body at the lower layer, thus the power energy transmission between the lead rails and the refrigeration case or between the refrigeration plants is realized, the layout inconvenience and safety hidden trouble caused by arranging leads are avoided; every lead rail is a dismountable structure, and both ends are connected to the other lead rail, the refrigeration plant can adapt to the area of different stacking zones, is convenient to expand; every device is an independent structure, and more convenient to transport.

The application provides a method for fabricating a printed circuit board. The printed circuit board includes a device layer and a plurality of wiring layers, wherein the device layer is provided witha first predetermined number of ball grid array (BGA) chips. The method includes steps of dividing back drill holes required by wiring into a second predetermined number of categories; determining the total number of the wiring layers including the back drill holes according to the second predetermined number of categories; and using the device layer as a first layer, arranging wires layer by layer in an depth-to-shallow order according to the depth of the back drill holes, wherein the back drill holes of the wiring layer where the wires are arranged earlier are close to the BGA chips, and the back drill holes of the wiring layer where the wires are arranged later are away from the BGA chips. The method can avoid the signal loss caused by too many wires spanning the back drill hole layerswhen the high-speed signal in the BGA chips is out of the PCB, can also arrange the wire sequence, reduce the wiring layers, and reduce the difficulty of manufacturing the printed circuit board. Theapplication also provides a printed circuit board and an electronic device.