69results about "Printed circuit assemblies" patented technology

LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techiques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and / or physically transform upon application of at least one internal and / or external stimulus.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

The invention discloses a printed board, which comprises a process frame, multiple jointed boards and multiple connectors, wherein the process frame is square, and the length-width ratio d is no less than 1 but no more than 2; the multiple jointed boards are arranged in the process frame; and the adjacent two jointed boards and the jointed board adjacent to the process frame and the process frame are connected via the connectors. According to the printed board of the invention, through limiting the length-width ratio d of the printed board to be no less than 1 but no more than 2, the printed board can be prevented from being influenced by a thermal stress when SMT is used for processing to get too much deformation, the deformation amount of the printed board is reduced, and the surface mount effect of the printed board is improved.

A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

A display device comprises a display panel, a carrying member, a plurality of circuit connecting boards, a control circuit board and at least a front frame member. The carrying member carries the display panel. The circuit connecting boards are disposed adjacent to the carrying member and physically and electrically connected to the display panel. The shortest distance between the two adjacent circuit connecting boards is between 0.1 mm and 20 mm. The control circuit board is disposed adjacent to the carrying member and electrically connected to the circuit connecting boards, and electrically connected to the display panel through the circuit connecting boards. The front frame member is disposed at the outer edge of the carrying member and connected to the carrying member, and includes a turning portion and an extending portion. The thickness of the turning portion is greater than that of the extending portion.

Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

The invention discloses a printed circuit board panel and a manufacturing method thereof, and belongs to the technical field of printed circuit boards. The printed circuit board panel comprises at least two single boards, wherein the adjacent single boards are connected with each other through a connecting rib plate; and the connecting rib plate and the single boards are in integrated connection. The printed circuit board panel disclosed by the invention is connected between the adjacent two single boards by the connecting rib plate, and is in integrated connection with the connecting rib plate, so that stamp holes between the single boards of an existing printed circuit board are omitted; and the step of punching between the single boards is omitted, so that the strength of the single boards is increased; and the production cost is also reduced.

An electronic equipment assembly apparatus includes a cable holding tool, a work stage, and a robot unit. The cable holding tool holds the cable. The work stage holds the electronic equipment. The robot unit relatively moves the cable holding tool with respect to the electronic equipment held by the work stage. The cable holding tool includes a contactor and a width direction regulator. The contactor holds the cable by vacuum-sucking. The width direction regulator regulates a position in a width direction of the cable which comes into contact with the contactor.

The invention discloses a printed circuit board assembly having a damping layer. The printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

The invention provides a rigid-flex board, which comprises multiple metal layers arranged in a laminated mode. The multiple metal layers are separated by insulated layers. The multiple metal layers comprise a first element layer, a second element layer, a first grounding layer, a second grounding layer, a first grounding blind hole and a second grounding blind hole, wherein the first element layer is arranged as an outer layer; the second element layer is arranged as an outer layer; the first grounding layer and the first element layer are adjacent; the second grounding layer and the second element layer are adjacent; the first grounding blind hole is connected with the first element layer and the first grounding layer; and the second grounding blind hole is connected with the second element layer and the second grounding layer. As the grounding layer is arranged adjacently to the corresponding element layer, the element layer and the grounding layer can be directly electrically connected through the blind hole, the number of through holes in the rigid-flex board is reduced, and the structural strength of the rigid-flex board is also improved.

The invention provides a rigid-flex board and a mobile terminal. The rigid-flex board comprises a flexible base material layer, a copper foil layer, a hard layer, a solder-resistant ink layer and a circuit layer, wherein the copper foil layer is laminated on the flexible base material layer; the hard layer is arranged on one side, away from the flexible base material layer, of the copper foil layer; the solder-resistant ink layer is arranged on the hard layer, a hollow window is formed in the solder-resistant ink layer for exposing a part of the hard layer, and the hollow window divides the solder-resistant ink layer into two parts facing each other, clamping grooves are formed in the two parts, and the two clamping grooves are communicated with the hollow window, the circuit layer is arranged in the hollow window and laminated on the hard layer, and both ends of the circuit layer are clamped in the two clamping grooves separately. According to the rigid-flex board and the mobile terminal provided by the invention, the two clamping grooves of the solder-resistant ink layer are used for clamping both ends of the circuit layer, so that the solder-resistant ink layer has a compression acting force on the circuit layer, the circuit layer can be prevented from being separated from the hard layer due to pulling situation when the circuit layer is connected with an electronic element, the connection strength between the circuit layer and the hard layer is enhanced, and the conduction connection of the circuit layer and the electronic element is ensured.

Circuit arrangement for motor vehicles comprises at least one semiconductor component (30) and at least one first metal carrier plate (2a) and one metal printed circuit board (2b). Versatile use is possible when the carrier plate (2a) is electrically insulated and at a distance from the printed circuit boards (2b), and the carrier plate (2a) is electrically connected to at least one of the printed circuit boards (2b) by means of at least one semiconductor component (30), so that the carrier plate (2a) and the printed circuit boards (2b) form an electrical triple pole.

High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.

The invention provides a special-shaped board splicing method and device based on an inscribed polygon.The method includes the following steps that a special-shaped board with a polygon inside is selected from N+1 special-shaped boards to serve as a mother board, and the other N special-shaped boards serve as daughter boards, wherein N is an integer larger than or equal to 1; after all the daughter boards are contained in board spaces in the mother board, irregular polygon inner frame lines NFP corresponding to the daughter boards are generated according to the collision principle; the N daughter boards generate the N irregular polygon inner frame lines NFP correspondingly in the mother board, and every two N irregular polygon inner frame lines NFP are combined to generate splicing combination diagrams of the N daughter boards; an optimal board splicing combination diagram is extracted from the splicing combination diagrams of the N daughter boards and is output.By means of the method, the PCB utilization rate can be increased, and the PCB splicing efficiency can be improved.

The invention discloses a vehicle-mounted remote control device. The vehicle-mounted remote control device comprises a shell and is characterized by also comprising a fundamental circuit board and at least one extension sub-circuit board, wherein the fundamental circuit board is arranged in the shell, the at least one extension sub-circuit board is inserted onto the fundamental circuit board in a plug-in and plug-out way, a plurality of extension slots are formed in the fundamental circuit board, and the at least one extension sub-circuit board is inserted onto the corresponding extension slot in a plug-in and plug-out way. In the abovementioned vehicle-mounted remote control device, the required extension sub-circuit board having an independent function can be arranged on the fundamental circuit board in a plug-in and plug-out way according to the demand or the customization of a client, so that a vehicle-mounted remote controller can meet the demands of various users and the customization of various users, the extension sub-circuit boards of each independent functional module can be changed, added or reduced at any time by the user during the application process according to the demands of the users so as to be adaptive to the real demand of the user; and the user only needs to purchase the extension sub-circuit board which can be plugged in and plugged out according to the demand, and the vehicle-mounted remote control device is simple to install and can be automatically installed by the user in no need of a professional worker.

Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

A communication system includes first and second circuit card assemblies mated such that first and second PCBs move relative to each other along a board mating axis parallel to a slot in the first PCB with the first PCB oriented perpendicular to the second PCB and with first and second mating ends of first and second electrical connectors oriented parallel to the board mating axis. The first and second circuit card assemblies are mated such that the first electrical connector and the second electrical connector move relative to each other along a connector mating axis perpendicular to the board mating axis. Mating interfaces the contacts are oriented at contact mating angles non-parallel to the board loading axis and non-parallel to the connector mating axis.

Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

The invention discloses a PCB assembly and a mobile terminal with the same. The PCB assembly comprises multiple PCBs and a longitudinal connector; the PCBs are divided into at least one group, each group comprises multiple PCBs, and the PCBs in each group are sequentially arranged side by side in the longitudinal direction; the longitudinal connector extends in the longitudinal direction and sequentially penetrates through the PCBs in each group. According to the PCB assembly, plate splicing and plate splitting processes are simple; meanwhile, connection rib positions arranged among the PCBs can be omitted, the PCB layout area is greatly decreased, and the cost is reduced.

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.