Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Special-shaped board splicing method and device based on inscribed polygon

A polygonal and special-shaped board technology, which is applied in the direction of assembling printed circuits and printed circuit components with electric components, can solve the problems of low utilization rate of Panel boards, low efficiency of panel boards, and low utilization of boards, so as to improve efficiency and reduce Waste, the effect of improving the utilization rate

Active Publication Date: 2016-07-13
SHENZHEN PARTNER INFORMATION TECH
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Panelists use CAM tools to manually import CAM files of multiple PCB material numbers, and manually combine multiple Sets (the smallest shipment unit of a class of PCB products) into one Panel (the smallest unit of production, synthesized by Set), if Set For a special-shaped frame, the manual time will be longer, and the panel utilization rate is often low. It takes about 30 minutes to manually assemble 20 material numbers, resulting in low panel utilization and low panel efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Special-shaped board splicing method and device based on inscribed polygon
  • Special-shaped board splicing method and device based on inscribed polygon
  • Special-shaped board splicing method and device based on inscribed polygon

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is a detailed description in conjunction with the embodiments and accompanying drawings.

[0035] The most critical idea of ​​the present invention is that the present invention first selects a mother board with polygons inside, and the rest are daughter boards, and then the daughter boards move inside the mother board to form multiple polygonal inner frame lines NFP, and two After the two combinations, a splicing combination diagram of N sub-boards is generated, and the optimal splicing combination diagram is output from the splicing combination diagram of the N sub-boards, which facilitates the direct splicing of the sub-boards to the inside of the mother board, which is beneficial to improve the efficiency of splicing And the utilization rate of the board.

[0036] See figure 1 , The present invention provides a special-shaped ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a special-shaped board splicing method and device based on an inscribed polygon.The method includes the following steps that a special-shaped board with a polygon inside is selected from N+1 special-shaped boards to serve as a mother board, and the other N special-shaped boards serve as daughter boards, wherein N is an integer larger than or equal to 1; after all the daughter boards are contained in board spaces in the mother board, irregular polygon inner frame lines NFP corresponding to the daughter boards are generated according to the collision principle; the N daughter boards generate the N irregular polygon inner frame lines NFP correspondingly in the mother board, and every two N irregular polygon inner frame lines NFP are combined to generate splicing combination diagrams of the N daughter boards; an optimal board splicing combination diagram is extracted from the splicing combination diagrams of the N daughter boards and is output.By means of the method, the PCB utilization rate can be increased, and the PCB splicing efficiency can be improved.

Description

Technical field [0001] The invention relates to the technical field of splicing, in particular to a special-shaped splicing method and device based on inscribed polygons, which can be specifically applied to the splicing of PCB boards and the automatic filling of special-shaped squares. Background technique [0002] At present, when the PCB (Printed Circuit Board) industry produces PCB prototypes, in order to save time and cost, a variety of PCB products of the same process will be manually assembled and produced, and then all the material numbers will be delivered to customers. Panelists use CAM tools to manually import CAM files of multiple PCB material numbers, and manually combine multiple Sets (the smallest unit of shipment for a type of PCB product) into 1 Panel (the smallest unit of production, synthesized by Set). For the special-shaped frame, the manual time will be longer, and the panel utilization rate of the Panel is often low. It takes about 30 minutes to manually pu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
CPCH05K3/36H05K2201/04
Inventor 曾波罗显锋
Owner SHENZHEN PARTNER INFORMATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com