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Rigid-flex board and mobile terminal

A technology of soft-rigid combination board and ground layer, which is applied in the structural connection of printed circuits, printed circuits connected with non-printed electrical components, printed circuit components, etc. Insufficient self-strength and other problems, to achieve the effect of improving structural strength and reducing the number of through holes

Inactive Publication Date: 2016-05-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the volume of the current multi-layer rigid-flex board is constantly shrinking, and too many via holes in the inner layer will cause the board's own strength to be insufficient and easy to break, etc.

Method used

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  • Rigid-flex board and mobile terminal

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for ...

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Abstract

The invention provides a rigid-flex board, which comprises multiple metal layers arranged in a laminated mode. The multiple metal layers are separated by insulated layers. The multiple metal layers comprise a first element layer, a second element layer, a first grounding layer, a second grounding layer, a first grounding blind hole and a second grounding blind hole, wherein the first element layer is arranged as an outer layer; the second element layer is arranged as an outer layer; the first grounding layer and the first element layer are adjacent; the second grounding layer and the second element layer are adjacent; the first grounding blind hole is connected with the first element layer and the first grounding layer; and the second grounding blind hole is connected with the second element layer and the second grounding layer. As the grounding layer is arranged adjacently to the corresponding element layer, the element layer and the grounding layer can be directly electrically connected through the blind hole, the number of through holes in the rigid-flex board is reduced, and the structural strength of the rigid-flex board is also improved.

Description

technical field [0001] The invention relates to the field of rigid-flex board manufacturing, and more specifically, the invention relates to a rigid-flex board and a mobile terminal. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards and double-sided circuit boards to multi-layer circuit boards. Multi-layer rigid-flex board refers to a rigid-flex board with multi-layer conductive lines, which has more wiring area and higher interconnection density, so it is widely used. [0003] Before designing a multi-layer rigid-flex board, the designer needs to first determine the structure of the rigid-flex board to be used according to the scale and size of the circuit, that is, to decide whether to use 4 layers, 6 layers, 8 layers, or more layers. Several rigid-flex boards. After determining the requirements for the number of layers, determin...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K1/18
CPCH05K1/144H05K1/182H05K2201/04H05K2201/09536
Inventor 曾元清
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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