The invention relates to the technical field of circuit board production, in particular to a circuit board which comprises a substrate and first conductive parts. The substrate comprises a device layer, a
signal layer and a
ground layer which are arranged in an overlapped mode, the
signal layer is located between the device layer and the
ground layer, and the device layer is provided with multiple
welding disks; the substrate is provided with blind holes which extend to the
signal layer from the device layer, one first conductive part is arranged in each
blind hole, and at least one
welding disk is electrically conducted with the signal layer through the first conductive parts. According to the circuit board, the blind holes are arranged and each internally provided with one first conductive part, and the
welding disks on the device layer can be electrically connected with the signal layer through the first conductive parts; therefore, the number of through holes in the circuit board can be decreased, destruction to the
ground layer is reduced, the integrity of the ground layer is well guaranteed, when an ESD problem occurs,
static electricity can be rapidly released, and the reliability of the
system is guaranteed.