Processing method of PCB and PCB

A processing method and copper layer technology, applied in the direction of electrical connection formation of printed components, electrical connection of printed components, printed circuit components, etc., can solve the problem of low wiring density, achieve the effect of increasing wiring density and reducing the number of vias

Inactive Publication Date: 2018-02-16
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a PCB processing method and PCB, to overcome the defects of low product wiring density existing in the prior art

Method used

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  • Processing method of PCB and PCB
  • Processing method of PCB and PCB
  • Processing method of PCB and PCB

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Embodiment Construction

[0034] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] see figure 1 , figure 1 The process flow of the PCB processing method is shown.

[0036] In the present embodiment, the processing method of PCB comprises the following steps:

[0037] S101 , according to the normal technological process, after completing the inner layer circuit pattern of the inner layer core board, pressing th...

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Abstract

The invention discloses a processing method of a PCB and a PCB. The processing method comprises: an inner core plate and an outer core plate are pressed together to form a PCB; a stepped through holeis formed in the PCB and plated-through-hole electroplating is carried out on the through hole, wherein the stepped through hole includes a first through hole portion and a second through hole portionin an axial direction, the aperture of the first through hole portion is larger than that of the second through hole portion, and a first step surface is formed between the first through hole portionand the second through hole portion; and all the or the part of copper layer of the first step surface is removed or at least one part of copper layer o the side wall of the second through hole portion is removed, so that the copper layer of the inner wall of the stepped through hole is broken to form at least two parts not in conduction. According to the invention, the copper layer of the innerwall of the stepped through hole is divided into two parts or three parts not in conduction, so that two or three network connection layers are realized by one through hole part. Compared with the prior art, the method enables the via hole number to be reduced on the PCB with the same area, so that the wiring density of the PCB is improved.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a PCB processing method and the PCB. Background technique [0002] With the development of high-density integrated circuit technology and microelectronics technology, the volume of electronic products has become lighter, thinner and smaller. At present, in the wiring design of high-level multi-layer PCB, the network connection between different layers uses vias, and usually only one network connection layer is designed for one via. Since each via occupies a certain area on the PCB surface, the larger the PCB capacity, the more design networks, the more the number of via holes, and the larger the design area of ​​the PCB surface, which cannot meet the requirements of thinner electronic products. Smaller requirements. Contents of the invention [0003] The object of the present invention is to provide a PCB processing method and PCB, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/11H05K3/429H05K2201/09845
Inventor 王小平何思良纪成光袁继旺陈正清刘梦茹
Owner DONGGUAN SHENGYI ELECTRONICS
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