Circuit board

Abstract

The invention relates to the technical field of circuit board production, in particular to a circuit board which comprises a substrate and first conductive parts. The substrate comprises a device layer, a signal layer and a ground layer which are arranged in an overlapped mode, the signal layer is located between the device layer and the ground layer, and the device layer is provided with multiple welding disks; the substrate is provided with blind holes which extend to the signal layer from the device layer, one first conductive part is arranged in each blind hole, and at least one welding disk is electrically conducted with the signal layer through the first conductive parts. According to the circuit board, the blind holes are arranged and each internally provided with one first conductive part, and the welding disks on the device layer can be electrically connected with the signal layer through the first conductive parts; therefore, the number of through holes in the circuit board can be decreased, destruction to the ground layer is reduced, the integrity of the ground layer is well guaranteed, when an ESD problem occurs, static electricity can be rapidly released, and the reliability of the system is guaranteed.

Description

Technical field [0001] This application relates to the technical field of circuit board production, in particular to a circuit board. Background technique [0002] In the production of multi-layer circuit boards, especially chips with denser pins, such as a circuit board including a CPU (Central Processing Unit, central processing unit), through holes are often opened to realize signal transmission, and the through holes penetrate through each layer, including In the ground layer, the through holes transmit the signal from the surface layer to the other layers. [0003] However, the pins of the chip are many and dense. If each pin transmits signals through through holes, the number of through holes that need to be opened is extremely large, resulting in too large through holes in the ground layer, discontinuous ground layer, and complete signal When encountering ESD (Electro-Static Discharge, electrostatic discharge) problems, static electricity cannot be quickly discharged, which...

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Problems solved by technology

[0003] However, the pins of the chip are relatively large and dense. If each pin transmits a signal through a through-hole, the number of through-holes needs to be opened is very large, resulting in too large a through-hole area in the formation, and the formation is discontinuous, resulting in signal integrity. When encountering ESD (Electro-Static discharge, electrostatic discharge) problems, static electricity cannot be released quickly, which will affect the normal operation of the system

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