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Printed Circuit Board Assembly Having A Damping Layer

A printed circuit board, damping layer technology, applied in the direction of printed circuit components, printed circuit components, printed circuits, etc.

Active Publication Date: 2017-03-08
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Waterproof layer can be used to protect electronic components from moisture

Method used

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  • Printed Circuit Board Assembly Having A Damping Layer
  • Printed Circuit Board Assembly Having A Damping Layer
  • Printed Circuit Board Assembly Having A Damping Layer

Examples

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Embodiment Construction

[0034] Embodiments describe printed circuit board (PCB) assemblies having one or more mechanisms for waterproofing electronic assemblies without substantially increasing acoustic noise radiation from the PCB assembly, particularly for use in electronic device applications. Some embodiments are described specifically with regard to integration within mobile devices, such as mobile phones. However, the embodiments are not so limited, and certain embodiments may be adapted for other uses as well. For example, a PCB assembly as described below may be incorporated into other devices and equipment, including desktop computers, laptop computers, or automotive vehicles, to name a few possible applications.

[0035] In various embodiments, the description is made with reference to the figures. However, certain embodiments may be practiced without one or more of these specific details, or in combination with other known methods and configurations. In the following description, numero...

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PUM

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Abstract

The invention discloses a printed circuit board assembly having a damping layer. The printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Description

technical field [0001] Embodiments related to printed circuit board (PCB) assemblies are disclosed. More particularly, embodiments related to a PCB assembly having several electronic components mounted on a PCB are disclosed. Background technique [0002] Electronic devices, such as computers and / or mobile devices, may include a printed circuit board (PCB) assembly having electronic components, such as integrated circuits and capacitors, mounted on the PCB. Electronic components may be electrically connected through printed circuits having vias and traces. When a voltage ripple occurs in a driving electrical signal delivered through a printed circuit, electronic components may be deformed. In addition, deformation of electronic components may transmit deformation loads to the PCB, which may cause the PCB to vibrate. Such vibrations may cause audible acoustic noise to radiate from the PCB and electronics of the PCB assembly. Contents of the invention [0003] A printed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0271H05K1/18H05K2201/04H05K2201/10227H05K2201/2045H01G2/06H01G4/224H01G4/30H05K1/141H05K1/181H05K3/284H05K2201/049H05K2201/10015H05K2203/1316H05K2203/1322
Inventor 李革民P·马丁内斯B·A·巴尔德C·R·都克龚中庆K·R·理查森C·C·米德K·普兰庾圣宇N·J·科特基
Owner APPLE INC
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