Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board panel and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuits, printed circuit components, printed circuit components, etc., can solve the problems of reduced hardness and softness, easy to warp, etc., and achieve increased strength, increased hardness, and reduced production. cost effect

Pending Publication Date: 2015-11-25
NUBIA TECHNOLOGY CO LTD
View PDF9 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a printed circuit board panel and its manufacturing method, aiming to solve the defects of the prior art that the printed circuit board panel is less rigid, soft and easy to warp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board panel and manufacturing method thereof
  • Printed circuit board panel and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] A mobile terminal implementing various embodiments of the present invention will now be described with reference to the accompanying drawings. In the following description, use of suffixes such as 'module', 'part' or 'unit' for denoting elements is only for facilitating description of the present invention and has no specific meaning by itself. Therefore, "module" and "component" may be mixedly used.

[0024] Such as figure 1 As shown, the first embodiment of the present invention provides a printed circuit board assembly.

[0025] The printed circuit board assembly includes at least two single boards 110 , and adjacent single boards 110 are connected by connecting ribs 120 .

[0026] In this embodiment, an integral connection is adopted between the connecting rib 120 and each veneer 110, that is, only one c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed circuit board panel and a manufacturing method thereof, and belongs to the technical field of printed circuit boards. The printed circuit board panel comprises at least two single boards, wherein the adjacent single boards are connected with each other through a connecting rib plate; and the connecting rib plate and the single boards are in integrated connection. The printed circuit board panel disclosed by the invention is connected between the adjacent two single boards by the connecting rib plate, and is in integrated connection with the connecting rib plate, so that stamp holes between the single boards of an existing printed circuit board are omitted; and the step of punching between the single boards is omitted, so that the strength of the single boards is increased; and the production cost is also reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board panel and a manufacturing method thereof. Background technique [0002] Nowadays, with the development of microelectronics technology, printed circuit boards are becoming thinner and thinner. However, in the prior art, printed circuit board assembly mainly uses stamp holes and connecting ribs to realize the splicing of printed circuit board sub-boards. Using this method of jigsaw board will be soft and easy to warp due to the reduced hardness of the whole jigsaw board, which is not conducive to the mounting of devices, so it cannot meet the current mounting of small devices, POP, high-density and other components. Therefore, it is necessary to provide a high-strength printed circuit board capable of satisfying thin boards and a manufacturing method thereof. Contents of the invention [0003] The main purpose of the present invention is to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/145H05K3/36H05K2201/04
Inventor 李建发
Owner NUBIA TECHNOLOGY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products