Printed circuit board panel and manufacturing method thereof
A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuits, printed circuit components, printed circuit components, etc., can solve the problems of reduced hardness and softness, easy to warp, etc., and achieve increased strength, increased hardness, and reduced production. cost effect
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[0022] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0023] A mobile terminal implementing various embodiments of the present invention will now be described with reference to the accompanying drawings. In the following description, use of suffixes such as 'module', 'part' or 'unit' for denoting elements is only for facilitating description of the present invention and has no specific meaning by itself. Therefore, "module" and "component" may be mixedly used.
[0024] Such as figure 1 As shown, the first embodiment of the present invention provides a printed circuit board assembly.
[0025] The printed circuit board assembly includes at least two single boards 110 , and adjacent single boards 110 are connected by connecting ribs 120 .
[0026] In this embodiment, an integral connection is adopted between the connecting rib 120 and each veneer 110, that is, only one c...
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