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Printed board

A technology of printed boards and jigsaws, applied in the directions of printed circuits, printed circuit components, printed circuit components, etc., can solve the problems of printed board deformation, affecting the SMT patch effect, etc., so as to reduce the amount of deformation and improve the paste Sheet effect, anti-deformation effect

Inactive Publication Date: 2016-05-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the panel design is not good, the printed board will be affected by thermal stress during the SMT furnace process, and the printed board will be deformed after the furnace, which will affect the SMT placement effect.

Method used

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Embodiment Construction

[0021] Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0022] Refer below figure 1 and figure 2 A printed board 10 according to an embodiment of the present invention is described.

[0023] like figure 1 As shown, the printed board 10 according to the embodiment of the present invention includes a process frame 1 , multiple panels 2 , and multiple connectors 3 .

[0024] Specifically, the process frame 1 is formed in a square shape with an aspect ratio of d, and d satisfies: 1≤d≤2. It should be noted that the square shape may be a rectangle or a square, that is, the process box 1 may be formed as a square or as a rectangle. When the length of the process box 1 is M and the width is N, the aspect ratio d=M / N, an...

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PUM

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Abstract

The invention discloses a printed board, which comprises a process frame, multiple jointed boards and multiple connectors, wherein the process frame is square, and the length-width ratio d is no less than 1 but no more than 2; the multiple jointed boards are arranged in the process frame; and the adjacent two jointed boards and the jointed board adjacent to the process frame and the process frame are connected via the connectors. According to the printed board of the invention, through limiting the length-width ratio d of the printed board to be no less than 1 but no more than 2, the printed board can be prevented from being influenced by a thermal stress when SMT is used for processing to get too much deformation, the deformation amount of the printed board is reduced, and the surface mount effect of the printed board is improved.

Description

technical field [0001] The invention relates to the field of printed boards, in particular to a printed board. Background technique [0002] With the rapid development of electronic products, the body of the product is getting thinner and thinner, resulting in thinner and thinner printed boards (such as PCB boards), and the size of single boards (such as PCB single boards) in printed boards is getting smaller and smaller , in order to improve the production efficiency of SMT (Surface Mount Technology), generally the single board will be assembled into several pieces, and then go to SMT patch together. If the panel design is not good, the printed board will be affected by thermal stress during the SMT furnace process, and the printed board will be deformed after the furnace process, which will affect the SMT placement effect. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K1/142H05K2201/04
Inventor 陈鑫锋黄廷夷
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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